HB-LED packaging - opportunities for suppliers of equipment materials in the latter segment

What kind of emerging markets will bring to the post device suppliers in 2010 billions of dollars in business opportunities? According to the research of YOLED vELoppement the French market research company, high brightness (HB) LED package will be the future of the annual growth rate of 25% in terms of big business; and HB-LED packaging market will exceed $three billion in 2015. Special packaging materials that are resistant to high heat and allow strong light output will be the main business opportunities. 2009 HB-LED industry's overall revenue of about $one billion and four hundred million, of which the packaging market is the contribution of $eight hundred and fifty million, that is, 60% fell into the pockets of the relevant suppliers. From the perspective of the needs of the industry at this stage, the demand for cutting, connecting wire, laser stripping equipment is still flat, but is expected to 2015, the market average annual growth rate will be 34%, as shown in the following figure.

Source: YoleD veloppement 2009 HBLED package Yole for the definition of HBLED than other market research institutions is narrow, only 30 lumens per watt output, as used in the automobile and TV backlight components, but most of the LCD backlight used in the classification of outside. Each package unit can output high brightness LED more than 100 lumens, including automotive headlamps and general lighting use, currently has $two hundred and eighty million in niche market; with the cost gradually improved, growth force can be expected. Thermal management of packaging substrate is the key

At present, the so-called high brightness LED, the typical energy conversion efficiency is less than 25%, most of the input power into useless heat, so the thermal management technology package has the largest improvement space, where is the companies to win the competition. Moreover, this area is also the most able to reduce costs. YoleD veloppement analyst PhilippeRoussel said, through the engineering research of well-known products industry reverse reduction, found that each of the chip technology are using the same material (IP), but it is completely different in the above package. Analysis shows that this is entirely based on the consideration of the cost structure, according to the projections, part of the total cost of package rate may exceed 70%. in recent years, many companies launched up to 150 lumens per watt output chip above, is largely due to advances in packaging technology.

There is a key to improve the thermal management, that is, accounting for half of the total package cost of the package substrate. Molding resin substrate (Moldedresinsubstrates) printed circuit board design and hot metal core slot collocation, is a widely used solution; but the components of higher power suppliers, have turned their attention to the ceramic substrate of aluminum or AlN, and the technology of ceramic or silicon wafer bearing version and the package substrate

Using silicon substrate to improve thermal impedance

But the most attractive potential is in the new alternative materials. The relationship between enterprise TSMC caijue science and technology using the eight inch wafer level packaging process, has started commercial production in high power silicon substrate (350mA) LED. development vice president Rong Baizhong revealed that the new anti resistance substrate does not exceed 3 DEG /W, the product efficiency is two to three times the use of ceramics. The number of output lumens can increase 10-15%.

The LED obtained from the manufacturer to cut the grain, the use of wafer level packaging process to simplify the grain processing; but does not refer to the component wafer packaging. First, the process of silicon wafer perforation, and then the metallization and dielectric protective layer, and then can be placed in the LED crystal, and then make the pin. The phosphor layer is covered with a yellow light stripping (maskandlift-off) technique, and then the lens is formed on the wafer. The key of the process is to control the flatness of the wire frame, and the lens forming technology must be developed. Wafer level process will help to reduce the cost of assembly costs in production, but at this stage of the cost of not taking the lead, but to focus more on the requirements of the application of thermal efficiency and reliability.

Caijue LED Packaging Industry Foundry model introduction of highly customized; relatively, the foundry process has also made some adjustments to allow LED grain arrangement, circuit layout and lens processing various design. Rong vice president, said the company's technology can be made up and down and lateral components, the scope of application covers the general lighting, backlight and a wide range of uses. Yu's orders from the beginning of August, has been received by the end of 2010; customers include outsourced packaging LED manufacturers, as well as downstream lightengine and lighting equipment manufacturers.

In order to reduce the cost of Tongxin copper ceramic

In contrast, tai-saw has also developed copper ceramic as substrate material, that can greatly reduce the cost of high performance LED package. Marketing Senior Vice President Lv Shaoping said, to estimate with high power white light LED chip 1 watt and 100 lumens of the total cost of $0.6, Taiwan companies use copper LED ceramic substrates can reduce the cost of this 5-10%. technology developed a strong adhesive layer is special, so it can be in the substrate via surface electroplating at the same time, saves a process, reducing the cost of. Moreover, the high thermal conductivity of copper is 390W/mK (AlN is 170W/mK, silicon is 150W/mK, Al2O3 is only 30W/mK), and also improve the efficiency of packaging heat dissipation.

Other potential business opportunities

LED packaging industry is looking forward to the development of new materials. High reflection coefficient (approaching sapphire 1.77) packaging and laminating material development has revealed the dawn. From the user's point of view, it will be helpful to use a HBLED system vendor to determine a standard package size