Hymite developed HB LED silicon encapsulation scheme

February 20, 2007, Hymite A/S (Denmark - German technology company, advanced packaging products supplier) announced the launch for highlight (HB) silicon package solution of LED -HyLED, this scheme can greatly reduce the material cost and the processing cost. Hymite said HyLED technology can help companies to achieve the smallest package at the same time improve efficiency, while Hymite, a major European customers (digital light source) has begun to use this package on its light source.

HyLED technology uses silicon wafer and micro mechanical / metal batch process to reduce the package size to 1/4, and the micro machined LED cavity can be used as the storage tank of the reflector, the heat conduction and the silicon. Silicon wafers perform well under heat and pressure. Hymite said that although silicon wafers may not have the performance of sapphire and GaN chips, but the cost savings, is the ideal choice for general lighting, mobile electronics, automotive lighting, panel backlighting.