In the core of Chengdu Q4 packaging and testing plant production Taiwan manufacturers no cooperation

According to Hongkong media reports: SMIC president and CEO Zhang Rujing yesterday (fourteen) announced that, with Singapore joint science and technology joint venture factory packaging, packaging and testing plant built in Sichuan Chengdu, production will start in the fourth quarter, the plant will be the main service in core international customers, have the capacity after the period of packaging and testing plant, more capable in core to provide unified service, expand market share in the mainland semiconductor market. The new factory is located in Chengdu high tech Zone West Park Export Processing Zone, covers an area of about 40 thousand square meters, officially built after the completion of an area of about 11 thousand square meters, the initial total investment amount is $175 million, memory and logic IC packaging and testing production line will be synchronized. Previously, SMIC has been looking forward to the cooperation and Taiwan packaging and testing plant, but subject to the restrictions of the Taiwan authorities, Taiwan has still failed to build, manufacturers of packaging and testing plant, finally SMIC chose Singapore and technology to establish a joint venture packaging plant in Chengdu. The joint venture invested 51 million dollars in the core, the new factory accounted for 51% stake in joint science and technology funds, technology, intellectual property and other shares, accounting for the new plant 30% stake, the remaining 19% of the equity investment by other personnel and related staff acquisition. Currently SMIC 12 inch wafer factory in Beijing received $600 million in loans this year, the Q1 capacity can still reach nearly a million pieces of the size of Q2 may reach about 150 thousand pieces of 8 inch wafer production capacity. But in the current core and eikner, stats ChipPAC, Weiyu science and technology cooperation agreement after the signing period of packaging production capacity is still facing pressure. Q4 plant is expected to put into operation in Chengdu, before the pressure relief.

Taiwan manufacturers hope that the Taiwan authorities have been able to lift the travel to the mainland to build factory packaging and testing ban, but it will not turn, thus including ASE, silicon products, Jingyuan electric semiconductor manufacturers are currently in production, or just select transistor packaging materials production plant.