Iteq made cooling material Laird Asia Pacific distribution rights, start effect will gradually appear next year

Taiwan Lianmao Dachang copper foil substrate 14 and the global advanced electronics and wireless products market key component leader Laird Technologies signed distribution cooperation and pressing process technical agreement, the future will combine iteq and Laird Technologie resources and industry status of the two companies will be unique, for LCD flat panel display LED backlight module exclusive the (BLU) to provide a variety of solutions.

Iteq chairman Wan Haiwei said, made in the Asia Pacific Laird agency, the first for PCB customers to develop, to help customers smooth introduction of thermal module production of LED plate, is expected to begin next year will be a contribution to the performance.

Haiwei is very optimistic about the application of LED in the future, the lamps and the notebook computer market of the most promising, but in the LED heat sink this market can be said to be "see, but do not eat", there are many customers want to enter but could not enter, so iteq will play to help customers develop and import business the point of view, at this stage already began to send samples for PCB customers and development, the future will also join the IM PCB production, expected monthly production capacity of about 5000 square meters.

000 Haiwei stressed that the current LED cooling plate on the market by single and double panel, and iteq in cooperation with Laird Technologie, LED will develop a multilayer heat pressing technology, the technology will be in the current market is competitive and unique.

Application of LED backlight module is rapidly growing, according to market research firm Displaybank, the size of the market will be 500% growth rates in the years 2007-2008. Laird Technologie T-lam high performance materials, is also expected to follow the LED market and the vigorous growth, because the brightness and color of LED decreases with the increase of temperature, for example, the red light at the higher temperatures, brightness will decrease by 50%, while the T-lam material can make LED components faster exhaust heat dissipation.

T-lam thermal printed circuit board (IM PCB) by T-Preg (thermal dielectric film), connecting copper foil and an integrated base metal (aluminum), make thin circuit board excellent cooling efficiency, better than the traditional FR-4 printed circuit board.

Iteq specializes in internal plate technology, including laminated plate, inner layer process and multilayer board pressing foundry (MassLam), currently in the cross-strait 5 has a production base, including Taiwan, Dongguan, Humen Ping Zhen factory, Wuxi Guangzhou factory and Dongguan Huang Jiang, in the production part of the copper foil substrate, on both sides of monthly production capacity reached 2 million Zhang, MassLam (multilayer board pressing) monthly production capacity of 1 million 300 thousand SF; as for the Guangzhou plant, is expected in October will start production, will be in the soft copper foil substrate (3FCCL) for the main products, monthly capacity planning of 100 thousand square meters.

Source: China PCB Technology Network