JPSA get LED vertical etching technology patented by South Korea

JPSA is the world's leading manufacturer and supplier of laser materials processing workstations, the LED wafer laser vertical etching technology has been patented.

The patent can be applied in korea. The patented technology is achieved through the use of a unique laser energy distribution system, narrow cutting, cutting width can reach 2.5 microns, but the cutting process faster, higher wafer output. And narrow cut can make the number of chip units (die) per wafer can be higher. JPSA improves the LED sapphire wafer slicing ability by improving the IX-200 UV diode pumped solid state (DPSS UV) laser system.

JPSA President Jeffrey P. SercEL said: "this new patented technology can improve the processing of LED wafer production. Using our Chromadice system, we can process 15 pieces of 2 inch wafers per hour through the patent process. Compared with the traditional diamond cutting and laser technology, the output has been significantly improved. "

The IX-200 ChromaDiceT DPSS system is not only a high precision wafer etching system, but also suitable for wafer welding and cutting applications. Its UV diode pumped solid state (DPSS UV) laser system can perform high speed wafer scribing, with a standard wafer rate of up to 99%, and the cost per wafer dicing is less than $2. In addition, the system can also be used to bend or deform wafers that can be applied to all wafer types. (http://compoundsemiconductor.net/blog/2008/01/jpsa_picks_up_led_scribe_paten.html)

Source: China Semiconductor Lighting Network