Japan developed a LED module to meet the requirements of high output power

Japan Tanaka precious metals industry company and S.E.I announced in April 4, 2016 that the use of gold particles (0.1 M class) low temperature bonding material "AuRoFUSE", developed to meet the requirements of high output power LED module. Under the influence of the heat generated by the LED lighting, the output power will decline, therefore, how to improve the heat dissipation of the LED module. The new product to solve this problem.

Module sample. Photo from and Optoelectronics Research and S.E.I.

The specific method is to use AuRoFUSE as bonding material for flip chip bonding, rather than the current mainstream mode - wire bonding. Flip chip bonding is the terminal protrusions (bumps) chip is connected to a lead frame and method of substrate in electrical mode, directly to the LED chip bonding to the substrate as a light emitting surface heat near the substrate, it is easy to make the heat. In addition, by removing the lead wire, the utility model can not only save the space occupied by the lead wire, realize miniaturization, but also improve the electrical property.

The structure of the newly developed module. Pictures from Tanaka precious metals and S.E.I.

However, in the past for flip chip bonding, must use expensive aluminum nitride on a substrate. This is because there is a big difference between the thermal expansion coefficient of the low price metal substrate and the LED chip, and the joint is easy to be damaged. In this technology, as the bonding material AuRoFUSE containing gold particles, these gold particles can ease the deformation of thermal expansion, so the use of inexpensive metal substrate. With this technology, we can realize the high power output and miniaturization of the LED module.

Tanaka precious metals will be held on April 6, 2016 at the Tokyo International Convention and Exhibition Center held in Japan, the third session of the high performance metal exhibition, through the company's booth to display the LED module. The company's future goal is to extend the scope of the use of the LED module to the import and export of refrigerated warehouses and the use of the advantages of miniaturization and other areas of vehicle lighting.

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