KINIK push new electroplating diamond wire technology to meet the needs of LED sapphire slice

China wheel (KINIK) (1560) the rapid response to market demand re innovation, will showcase the latest electroplating diamond wire in 2012 SEMICON semiconductor International Exhibition (ELetroplated Diamond Wire) technology, will be more effective to solve the high hardness of sapphire substrate LED upstream of the key materials (Sapphire) slices, and is expected to meet more than half of 2013 the demand of Taiwan market.

The sapphire substrate (Sapphire) is still the most critical materials currently used upstream of LED, with the increasing demand for high power LED, sapphire demand is gradually converted to large size; and the sapphire substrate due to high hardness of the material characteristics, in the process of the present section, all lines using fixed abrasive diamond electroplating line (Eletroplated Diamond Wire), to carry out multi line type wire sawing; according to statistics, at present Taiwan sapphire industry section, the total monthly demand of electroplating diamond line about 5000km.

Multi line type wire saw is of semiconductor, crystal, single crystal, fine ceramics, magnetic materials, a method of processing and other hard brittle material cutting. Free abrasive wire saw is widely used in slicing process of semiconductor and solar silicon wafer, the use of steel to free abrasive (abrasive + liquid) to remove waste material, but due to the abrasive free abrasive wire saw after use, there are environmental treatment problems need to be recycled, and the processing efficiency is low, so the development of fixed abrasive saw the industrial sector has become an inevitable trend.

Chinese wheel: electroplating diamond line latest patented technology for coating, the middle layer in the center line, the abrasive evenly embedded, can effectively avoid the aggregation problem of abrasive electroplating deposition; subsequent plating metal protection layer, back cover fixed abrasive, can be more firmly grasp and increase the service life and abrasive. The machining efficiency and wire at the same time, a metal protective layer of abrasive surfaces can play the buffering and protective effect, to improve the quality of the cutting surface.

Chinese wheel grinding not only master the core technology, successfully applied precision grinding technology in semiconductor wafer regeneration process, repeated success in sand, TSMC also won the "exemption storage" award, in 2011 won the Taiwan 100 brand TOP 100 award. The latest electroplating diamond line patent technology is bound to benefit the market again, stimulate production capacity.