Key technology breakthroughs drive LED applications

2008, to improve the ability of technology innovation and application development of LED products in China gradually, the research status of device reliability is more and more prominent, test methods and standards Jianxingjianjin, all of which were marked Chinese LED industry has entered a new stage of development. After years of development, China's LED industry has initially formed a complete industrial chain, including epitaxial wafer production, chip preparation and packaging, as well as LED product applications. Technical innovation, especially in the crystal photoelectric silicon substrate light-emitting diode materials and devices, as the representative of the industrial projects, and the Beijing Olympic Games is the application of LED to a new height.

2008, the Beijing Olympic Games "bird's nest", "Water Cube" and other venues with high brightness LED chip has been provided by domestic manufacturers, but also completely reversed the situation of foreign high-end LED chip monopoly of the domestic market. This shows that China's LED industry in the experience of the device to buy, buy chips, buy epitaxial film after the road, has now really had the ability to produce epitaxial wafers and chips. On the other hand, by the 2008 Beijing Olympics unveiled the new LED applications will continue to "have a fever", coupled with the 2010 Shanghai World Expo and Guangzhou Asian Games and 2011 Shenzhen World University Games coming soon, LED large billboards, driven by the landscape architecture as the application opportunities, but also the focus of concern LED industry in 2009 the.

2009, from the two aspects of market and technology on the development of LED: from the perspective of the market, LED display, LED landscape lighting and greater market share, traffic lights, car lights, LED lights, LED TV special, semiconductor lighting is developing rapidly, it is worth attention. From a technical point of view, whether it is blue and green LED red or yellow light LED, both sapphire, silicon carbide, silicon substrate or GaAs substrate, manufacturing technology of ultra high brightness LED chips were developed to take this technical route stripping substrate. This high photoelectric performance of the thin film chip, will become the mainstream of high-end products, so for this thin film chip, epitaxial, chip and package three pieces of close cooperation and technological innovation is imperative.