LED and Infineon proposed power semiconductor and LED package thermal resistance detection method to become the JEDEC standard

America Technology (Mentor mentor Graphics) announced that the company based on MicReD (MicroELectronics Research and Development) sector and Infineon Technologies (Infineon Technologies AG) semiconductor sealing resistance detected by the proposed method Automotive Power Application 2005 jointly published ideas, has become JEDEC (Joint Electron Device Engineering Council standard). This method is mainly used in the field of power semiconductor and led, which is used in the single heat dissipation path.

The corresponding specifications in November 2010 was identified as "JESD51-14" standard management of thermal characteristics of semiconductor package evaluation technology of JEDEC JC15 committee. The standard is named as "double sided transient detection method for detecting the thermal resistance between the junction (the device's junction) and the shell (a package shell) when the heat flows through a single path semiconductor device".

The standard (and mentor and Infineon jointly issued in 2005) the technology of MicReD based on the introduction of: (1) static (transient thermal resistance detection technology has become the JEDEC51-1 standard), (2) obtained by the technology of time - temperature distribution information derived constructor (or resistance - graphics display function the relationship between the heat capacity). In addition, (1) and (2) of the two technologies have been achieved by using the thermal conductivity of the thermal conductivity of the "T3Ster" and its software.

Thermal resistance detection method using T3Ster. Firstly, the time distribution of temperature is obtained by T3Ster. Then use the software to convert the time distribution information to the constructor. Photo provided by the ming.

Constructor meaning. Thermal structure of packaged device as object. Photo provided by the ming.

Co sponsored by Ming and Infineon in 2005. Images provided by Ming and infineon.

The method of JESD51-14 includes two kinds of situations, including the isolation layer and the isolation layer, which are based on (1) and (2) these two techniques. The consistent part of the constructor can be used as the high precision of the resistance between the junction and the shell. In addition, when the heat dissipation path of the microprocessor is not single, the thermal resistance can be obtained by changing the design of a single path and the multiple detection.

In the bright guide announced the news at the same time, Infineon in March 2011 20 ~ 24 day held in the International Conference on "2011 IEEE SEMI-THERM Thermal Measurement, Modeling and Management Symposium", published relevant papers and JESD51-14. In addition, the above mentioned MicReD department is headquartered in Hungary Budapest enterprises in 2005 (MicReD Kft.). MicReD was the acquisition of British Flomerics Group PLC. Later, in 2008, the acquisition of the guide and the acquisition of Flomerics, has now become a leading MicReD sector.