LED jewelry lighting packaging development

Introduction: LED jewelry lighting has a lot of light by refraction to jewelry from the LED chip to the external lighting irradiation, developed on the surface of the chip coated with a layer of silicon in the refractive index of transparent resin between the air and the LED lighting chip jewelry, and the transparent resin surface with a certain angle, so that the light can be high shine, this will improve the luminous efficiency of up to 2 times of the original product.

At present, the traditional epoxy resin, due to the high thermal resistance, anti ultraviolet aging performance is poor, the development of high pass rate, heat resistance, high thermal conductivity, UV and solar radiation and moisture resistance of the packaging resin is also a trend. In the aspect of solder, it is an important task to develop lead-free solder with low melting point to meet the requirements of environmental protection, and to develop more effective thermal conductivity and low stress on LED chip.

LED jewelry lighting packaging development

The using large chip package.

Replace the small chip 0.3mmx0.3mm with large size chip 1mmx1mm, the chip can greatly improve the injection current density was under the conditions of using large chip package technology is a major development trend.

The development of the new package material.

The development of new high thermal conductivity material, so that the LED jewelry lighting chip current density 5~10 times. The current trend of view, the main choice of high heat conductivity metal substrate materials, such as aluminum, copper or ceramic materials, but these materials and inter chip thermal expansion coefficient difference, if the direct contact is "because when the temperature rises to material stress produced by reliability problems, so usually in the material with both conductivity and expansion coefficient of intermediate material as the interval.

The multi chip package.

At present, there exists the problem of large size chip package light uniformity and heat dissipation to be solved, high power LED lighting chip jewelry using conventional high density combination package can get higher light through the mother, is a feasible and very high power LED lighting jewelry promotion before recording the solid light source. Small chip technology is relatively mature, a variety of high thermal insulation insulation aluminum substrate for chip integration and cooling.

The plane modular package.

The plane module package is another development direction of packaging technology, this package is good light source is composed of modules, its shape and size has great flexibility, very suitable for indoor lighting design, the cascade between the chip and the on-off protection is a difficult problem. The planar module encapsulation is a feasible way to obtain more power Qian LED jewelry lighting.