LED lighting successfully imported 8 inch epitaxial wafer level packaging

According to LEDinside news, a new photoelectric (NeoPac Opto) announced that the company with the solid-state lighting platform (NeoPac Universal Platform) and the sustainability of the LEDs standard light source technology, has successfully developed 8 inch wafer level LEDs package (WLCSP) technology, this technology will be of high brightness LEDs used in the manufacture of the polycrystalline package, single point light emitting element (NeoPac Emitter), and with the cooling mechanism of the patent system is made into packaging (System-In-Package) LEDs illumination light engine (NeoPac Light Engine). This is used for general lighting LEDs light engine, plans to be formally introduced in the first half of 2011 production. It is estimated that the company's LEDs lighting technology and a substantial push to a new realm.

WLCSP (Wafer-Level-Chip-Scale-Package) refers directly to complete the LED chip in the silicon epitaxial wafer on the wire, fluorescent powder coating and packaging technology. According to the company said, at present polycrystalline packaging new photoelectric light source technology, and then mix and match its patented antipyretic technology, each single package of the new light light engine can provide maintenance standard point lumens up to 1000 lumens of light source, the key is that this is a suitable for LEDs lighting two times optical design point light source package technology, and the effective service life (Useful Life) can be up to 60 thousand hours. This also means that a 8 inch silicon epitaxial wafer package can provide a total light output of more than 500 thousand lumens.

According to the new strong photoelectric sustainability of the technology roadmap and LEDs luminous efficiency year after year, it is estimated that in two years after the same piece of a 8 inch epitaxial wafer level LEDs package can reach the light output of 1 million lumens. This technology developed by the LEDs lighting with a large number of production characteristics, will help reduce manufacturing costs. LEDs epitaxial wafer level packaging technology, similar to the current mature DRAM industry, which once again declared LEDs lighting technology will mature.