LED manufacturers to improve output power through multi chip integration

Although relatively large Chinese manufacturers are new faces in the high-power LED market, but they have made great progress in product development competition. Manufacturers are developing a variety of LED packaging technology, of which the most important is the multi chip integration, that is, a LED package in a few LED chips in order to obtain high power. At the same time, these companies are also investing in R & D efforts to improve heat dissipation, improve luminous efficiency, improve reliability and reduce light attenuation.

Lighting electronics manufacturers increasingly favored high-power LED, which makes LED manufacturers greatly encouraged. In the case of similar brightness levels, the power consumption of 75lm/W high power LED is only 20% of incandescent lamp. These high power LED also has the advantages of high brightness and long service life, and the color is diverse, the use of more secure, very suitable for lighting and backlight applications.

High power LED quickly seize the traditional market

StrategiesUnlimited is expected in 2008 the world's high power LED packaging sales revenue will grow by 12%, in 2012 the world's largest power LED sales revenue will reach $11 billion 400 million, an average annual growth of 18%. Lights and monitors, including LCD TV backlight, will be the largest application areas. StrategiesUnlimited expects solid-state lighting (SSL) will be the main driving force to promote the growth of the LED market, in 2012 its sales revenue will grow to $1 billion 370 million. Large backlit will reach $2 billion 700 million by 2010.

Mainland China has a mature LED supply chain, covering epitaxial wafers and LED chips and packaging, focusing on large size LCD backlight, road lighting and home lighting applications. China Industrial Research Network confirmed that in 2007 about 20% of the mainland GaNLED chip is produced locally, and in the past five years, the region's GaNLED chip all rely on imports.

Taiwan also has more than and 20 suppliers to produce more than 1W rated power LED, the main applications include telecommunications, consumer electronics and automotive products. These manufacturers generally have factories in the mainland, but the R & D center in Taiwan.

Taiwan Optoelectronic Technology Industry Association (PIDA) estimates that in 2007 the Taiwan area LED package operating income is $1 billion 540 million. This year is expected to increase by 18% in 2007, up to $1 billion 840 million. From the LED chip and packaging output value, the Taiwan region ranked second in Japan after.

Hongkong has about 30 LED bulb suppliers, of which 50% produce high power, high brightness LED. The biggest suppliers are not mainland companies with sales offices in Hongkong. Manufacturing activities are carried out outside Hongkong, mainly in Guangdong. Small suppliers are mostly engaged in LED and finished goods trade.

Suppliers in the past few months have been actively promoting high-power LED, high-power, high brightness LED production steadily, although its output share is still very small. The average cost of LED chips is decreased by 20~30% per year, with the development of LED chip technology and the speed of mass production, it is expected that prices will continue to decline. Therefore, the LED offer is expected to be down 10~20%. All types of LED, including high-power LED, will be reduced.

According to FPDisplay, LED and CCFL backlight unit price gap will be significantly reduced, if the LED backlight unit price in 2007 is three times that of CCFL, while at the end of 2008 will be just 1.5 times as CCFL, so the LED backlight unit for the next few months will seize a large number of traditional CCFL market. Given the decline in the cost of key components, LED manufacturers hope that within two or three years of high-power LED can occupy the mainstream applications, and become dominant lighting technology.

Shenzhen Ruifeng optoelectronics Co., Ltd. believes that the price of LED chips may be reduced by 10~20%, while Shenzhen Jun and Optoelectronics Co., Ltd. is expected this year, prices may drop 50%. Last year, the capacity utilization of mainland manufacturers is 80%, the majority of manufacturers plan to expand production capacity of more than 50% this year, to meet the growing demand. For example, Ruifeng electronics investment of about $1 million 300 thousand to expand production capacity, is expected in 2008 will grow to five times. Jun and photoelectric capacity utilization of about 60%, the company plans to increase production capacity to 600 thousand by the end of this year, sales revenue is expected to reach $4 million 700 thousand. Technology Co., Ltd. is a large branch in Shenyang to build a new production base. Shenzhen Quantum Optoelectronics Co., Ltd. also said it would invest $2 million 300 thousand to build a new automatic production line in 2009, is expected to be high power LED month production capacity will reach 5 million.

Advanced packaging technology to improve power

The mainland manufacturers can single high power LED mass production of 1W to 3W, in order to improve the output power, many manufacturers began to multi chip integration, the package such as eutectic chip bonding technique for high power LED's own advanced technology. The technology combines the bonded wafer with the heat sink and then encapsulates it. This technique does not require any paste material to shorten the cooling channel, thereby significantly reducing the thermal radiation.

According to 120lm/W, the maximum luminous efficiency of RF-WMPW06LS is 5000, the thermal resistance is less than 9 /W, and the attenuation of light is less than 5%, which can withstand the wave soldering. Ruifeng photoelectron is focused on the development of luminous efficiency up to 150lm/W new products.

Quantum Optoelectronics and Wuhan University, Central South University and Hangzhou University of science and technology to establish a cooperative relationship, joint development of multi chip integrated packaging technology. The company's production of high-power LED latest product luminous efficiency of up to 110lm/W, thermal resistance of 8 /W to 12 DEG C /W. The company also plans to produce up to l25lm/W, thermal resistance of 4 /W to 10 DEG C /W, the lower the level of attenuation of high-power LED.

Shenzhen Fangda optoelectronic technology