LED package: R & D and integration capabilities equally important

Epitaxial and chip cooling structure is important, the subsequent design of the package heat is equally important. Domestic LED packaging technology has made great progress, but still lack of original technology. The development of packaging technology does not represent the maturity of market development capability. With the development of LED industry, the industry views on the LED industry chain is gradually changing, more emphasis on the importance of previous upstream chip, epitaxial growth technology, and now also to pay more attention to packaging technology, because the LED heat dissipation, light efficiency and reliability are closely related and package level. According to experts, many of the core technology of LED packaging involves, in addition to its advanced packaging equipment, including package structure, welding line parameter optimization technology, chip, phosphor and the best collocation technique, glue glue injection baking technology, light color and light uniformity technology screening technology, the technology process and the only way which must be passed the continuous improvement and development of low thermal resistance and excellent optical properties, high reliability LED products. Technical differentiation is one of the main embodiment of the competitiveness of high-tech enterprises, the same is true in the packaging industry. From the current domestic LED industry, a large number of enterprises, but the scale and competitiveness of enterprises are not many, the main reason is that most companies do not do differences in packaging technology, has made real technical content of products. In some areas, after the success of a LED enterprise, the local other companies have followed suit, get the equipment on the horse, and in the process and technology research and development is not mature. This leads to the production of LED products in light efficiency, service life are not up to the desired target. Therefore, the research and improvement of packaging technology is the basic condition for the enterprise to obtain the competitive power. And if the whole chain from the point of view, the importance of packaging is not only in the technology itself, but more importantly, it is the development of LED technology and downstream applications market demand closely linked. Applications that do not have technical support can not be achieved, and technologies that do not take into account the requirements will not have a strong vitality. Packaging enterprise is the combination of the two to achieve the development of the LED market. Because of this, the core competitiveness of packaging enterprises is also the extent to which the enterprise can follow the upstream chip technology and the ability to penetrate the downstream application market. Some LED packaging enterprises in the success, to the upper reaches of the infiltration, began to develop chips and epitaxy, which is the industry known as vertical integration. Therefore, some people believe that the domestic LED industry began to move towards the road of vertical integration. In my opinion, at this stage, this is not the purpose of the integration of enterprises to expand the scope of business, and the chip research and development capacity of enterprises rarely, these research and development are also in the laboratory stage, on production. Companies now do the purpose of chip development, in fact, in order to get more competitive in the packaging business. In essence, the route is determined by the extension package and chip, because the chip structure design and extension, has been basically determined LED subsequent welding mode, the package also determines the basic form can be taken. Therefore, the upstream chip and the extension of the research is in order to advance the packaging technology. What can not be ignored is that the differentiation of packaging technology also needs to be realized through market research. In addition to the upper reaches of the concern, do package, we must also focus on the development of the downstream application market, so that the direction of the development of technology and application needs. In fact, the gap between China's packaging enterprises and international advanced enterprises lies in the ability of the downstream market. For example, in 2009 the rapid development of small and medium size backlight market, domestic enterprises did not get a lot of market share, although domestic enterprises in small and medium size backlight LED packaging technology has been very mature. The main reason is that there is no opportunity to seize the opportunity in the market. The international LED technology innovation, but also on the basis of the establishment of the market, in order to push the application of the direction of the light source structure and packaging structure, and then pushed to the chip and epitaxial design. Therefore, the domestic packaging enterprises to gain competitiveness, the need to do a lot of work, not just stay in the process and structure of the research and equipment level, and to really grasp the true meaning of the package.