Laird, alliance alliance, join hands to grab the LED backlight module Market

CCl (Copper clad laminate, CCL) manufacturer iteq electronic (ITEQ) and Laird Technologies had earlier signed an agreement, Laird will provide LCD for flat panel display LED backlight module with high heat dissipation efficiency of T-lam materials, Lianmao electronics provides the technology and capacity of multi layer circuit board pressing process.

T-lam thermal printed circuit board Laird developed for flat panel display backlight module (IMPCB) with independent heat dielectric film T-preg, connecting copper foil and an integrated metal base, radiating efficiency beyond the traditional FR-4 printed circuit board. Vice president of Laird heat dissipation products division and general manager MichaEL Dreyer pointed out that the use of T-preg material plate, the cooling efficiency is at least 10 times FR-4, more suitable for flat panel display products with high luminous efficiency and high luminance LED.

Market research firm Displaybank noted that the locking LED backlight module market size LCD TV, there will be 500% of the growth rate between 2007 and 2008. 2008~2010, LED backlight module market is expected to be 2 million 500 thousand, 5 million 200 thousand and 9 million 500 thousand units, the growth rate of up to 2 times in the past 4 years, Dreyer forecast.

The main light source of the display backlight module has shifted from the traditional cold cathode tube (CCFL) to a higher luminous efficiency of the LED, because the CCFL color gamut is about 80%, but LED can reach more than 105% NTSC, Dreyer said. However, the use of LED as a light source transfer trend has also brought more heat demand, but also provides greater opportunities for the heat market.

Dreyer pointed out that IMPCB can reduce 50% emitted by the LED grain temperature, due to LED's brightness and color will be weakened with the increase of temperature, therefore, in the design of the backlight module, the radiating material is playing a more and more important role. For example, the red light at a higher temperature, brightness (luminance) will be reduced by 50%, while the T-lam material allows the LED component faster heat dissipation.

Iteq existing IMPCB monthly capacity of 5000 square meters, iteq chairman Wan Haiwei said, because the IMPCB is non - standard products must be customized according to customer demand, so there is no expected capacity expansion situation. However, Haiwei and Dreyer have said that the need to cope with the large and high quality display, with a higher efficiency of the heat sink will become mainstream.

Source: Electronic Engineering album