Many countries and regions to cancel the MCP package tariff industry

America, South Korea, Japan, Taiwan and the European Commission China (European Commission) represents a recent meeting in South Korea, to finalize the duty-free multi chip IC (multichip IC) draft agreement. American Semiconductor Industry Association (SIA) and the U.S. Information Technology Industry Council (ITI) and other industry organizations welcomed this. These countries and regions are expected to be lifted from January 1, 2006 on the multi chip packaging IC tariffs.

"Information technology agreement" (ITA) semiconductor covered in many parts of the world are tax-free. However, due to the inclusion of more than one chip in the multi chip package, the customs authorities put it into the category of non tax exempt. The United States, South Korea and the European Union impose 2.6-4% tariffs on these semiconductor products.

"This is what we strive for the elimination of tariffs and reduce multi chip semiconductor technology costs for consumers around the world, a great progress has been made in the." SIA President George Scalise said in a statement. "MCP is a new, fast-growing product. Zero tariff reduction of this product is essential to ensure that it continues to grow."

"This is to ensure the rapid development of international trade rules and technology is an important measure to maintain synchronization." ITI President Rhett Dawson said. "When WTO's" information technology agreement "to eliminate the many products including semiconductors IT tariff, was not like MCP products - but now they are a key component of the global mobile communication."

Analysts predicted that in 2008 the global multi chip packaging market will grow from $4 billion 200 million in 2004 to $7 billion 920 million, almost doubled, the compound annual growth rate of 25%.