Molex launched the market's first LED array plastic substrate technology

Leading full set of interconnect products supplier Molex company announced the launch of electrical, mechanical and optical integrated connectivity model LED array substrate holder technology, which is the industry's first integrated interconnection system and plastic substrate technology.

LED array existing solutions, LED array metal printed circuit board or ceramic array substrate often need to make some compromise between the small lamp base size cost saving and optical properties to provide the necessary challenge, also need to provide integrated electrical, mechanical and optical properties, for use in lighting system. Molex's new technology transfers connectivity and ease of use from the LED array substrate to a separate plastic substrate, thereby enhancing the thermal, optical and mechanical interconnection capabilities. The plastic substrate can be combined in a variety of ways with the LED array package to provide a top surface of the LED array with a plurality of connection options.

This new technology jointly developed with BridgELux has been integrated into the Vero* array Bridgelux in the newly released products. This expected a new interconnect technology can make the LED array products in the future easier integration and has higher cost benefit, can let manufacturers reduce the cost of the system LED OEM lighting lamp design, accelerate time to market, and improve the reliability. These technical improvements include a heat insulation pad, Molex Pico-EZmate connector, and improved the mechanical and optical properties of the reference attachment, while maintaining a very low side. Compared with the existing LED array package, which is required to be welded on aluminum or ceramic materials, the design of the new product can simplify the direct welding procedure and improve the robustness. The Pico-EZmate connector adapter option has no welding electrical interface and is helpful for on-site maintenance and replacement.

Bridgelux sales and marketing director Jim Miller said: "the new interconnect technology is an important improvement of LED light source package, which simplifies the integration of our customers in a variety of real-time system, help to open the wisdom of lighting system era. We know that technology convergence in the field of solid state lighting will soon occur, as in the case of consumer electronics. Fusion requires more functionality, sensors, communications and other features integrated into the LED lighting engine, which is suitable for the use of high-level platform for the use of new product architecture to achieve integration. "

This plastic shell with Molex based interconnect technology for consumer electronics and other mass market technologies, Molex will provide UL certification Pico-EZmate wide inserted wire harness product, can use the Vero series of products with high cost-effective, simple real interconnection system is stable.