NXP released LED backlight driver UBA3077

Day ago, NXP semiconductors (NXP Semiconductors) published 3 channel LED driver UBA3077 applied to LCD display backlight, LED backlight can provide support for the popularization of LED and general lighting, and will soon be listed on. UBA3077 support through low current dimming, can accurate constant current drive LED lamp string and improve LCD display backlight function, including deep dimming, enhance the picture quality. With up to 94% of the effectiveness of the designer can be designed by the UBA3077 thinner, lower power consumption and better heat dissipation LCD panel, with a better contrast to create a more beautiful picture quality. UBA3077 using CMOS50 power management (Power Management PM) process, especially high voltage for the integration of the digital environment in the design, the characteristics of the power supply combined with digital processing technology and perfect complex, provide first-class performance. The drive to boost converter and power with integrated MOSFET, help designers reduce application size and decrease the cost of the external components, and output light in less than 1% under the condition of deep dimming, to improve picture quality. UBA3077 consists of three independent channels, each integration the step-up converter and power supply, make application design by LED for additional radiating lamp string does not match the voltage. At the same time, the driver also for each channel with independent pulse width modulation (pulse width modulation, PWM) control, to provide a high degree of efficacy and precise light control. 14 bit PWM dimming (generated by the system PWM or internally generated) up to 24kHz (duty cycle from 0.1% to 100%). UBA3077 operating voltage range of 10V to 42V, can drive up to three groups (each group of LED lamp string lamp string composed of 20 LED), the rated current of each lamp string can be as high as 150mA. Can be automatically operated or controlled via 400kHz I2C bus. UBA3077 using HVQFN40 package, through the PCB to achieve good heat dissipation.