New progress in the industrialization of large diameter semiconductor silicon materials in China

Days ago, China's large diameter semiconductor silicon materials industry has made new progress, Beijing Nonferrous Metal Research Institute, National Semiconductor Materials Engineering Research Center and GRINM semiconductor materials Limited by Share Ltd combined capture of 0.13-0.10 micron integrated circuit with a diameter of 12 inches polished monocrystalline silicon project complete technology, user trial and delivery assessment the current monthly 10 thousand pilot production line of products has begun.

Silicon wafer is an important basic material in semiconductor industry. At present, the diameter of 12 inch silicon wafers in a period of rapid development, by the end of 2005, the whole world has completed 46 12 inch integrated circuit wafer production line, annual demand amounted to more than 14 million, China is expected to "11th Five-Year" during the annual demand of 12 inch diameter polished single crystal silicon wafer will reach 120-240 million tablets.

"95", "fifteen" period, in the relevant national plans under the support of the Beijing Nonferrous Metal Research Institute at the international technology development, adhere to independent innovation, has completed the construction of the National Engineering Research Center of semiconductor materials. At the same time, the growth, wafer processing, wafer testing and other aspects of analysis of large diameter silicon single crystal has carried out a large number of technical research, breakthrough of large diameter silicon single crystal growth and wafer processing engineering complete technology, and formed a professional engaged in silicon material production and technology development capabilities.

The diameter of 12 inch silicon single crystal polishing piece engineering technology and the production of pilot production line, will have a very important role in the development of China's high-tech industry.