New strong photoelectric developed 8 inch epitaxial wafer level LEDs package (WLCSP) technology

Neopac (NeoPacOpto) announced, has been successfully developed 8 inch wafer level LEDs package (WLCSP) technology, high brightness LEDs will be used to manufacture the polycrystalline package, single point light emitting element (NeoPacEmitter), and with the cooling mechanism of the patent system is made into packaging (System-In-Package) the LEDs illumination light engine (NeoPacLightEngine). Wafer level chip package (WLCSP), the first packaging and testing in the whole wafer, and then cut into IC particles one by one, so the original size of packaged as IC bare crystal volume. Compared to the first cutting and packaging and testing, packaging after adding at least traditional chip package original chip 20% volume, significantly reduce the size of the memory module not only, but also accords with the demand for mobile devices with high density body space, but also enhance the speed and stability of data transmission. WLCSP has the following advantages: data transmission path is short, high stability: the WLCSP package, the wiring line is short and thick (marked A to B the yellow line), it can effectively increase the data transmission bandwidth to reduce current consumption, but also enhance the stability of data transmission. Good heat dissipation characteristics due to WLCSP less plastic or ceramic packaging of traditional seal, so the IC chip operation when the heat can be effectively spread, without increasing the host body temperature, and the characteristics of the heat dissipation problem of mobile devices of great help. Original chip size minimum package: the biggest characteristic of WLCSP wafer level chip package is effectively reduced package size, so it can be in collocation on mobile devices and in line with the demand characteristics of portable products, short thin. This technique for general lighting LED light engine is planned in the first half of 2011 officially into mass production.