OSRAM cooperates with seven manufacturers to improve part of LED manufacturing process

OSRAM optoelectronics has formed an alliance with seven partners in science and industry. From December 2014 to February 2018, it participated in the InteGreat research project sponsored by the German Federal Ministry of education and Research (BMBF). It studied the current LED production process and related technologies in depth, and improved some manufacturing processes.

OSRAM launches planar interconnection technology (source: OSRAM official website)

In the process of participating in the research, seven manufacturers made in-depth research on the production of surface emitting small LED chips, packaging technology and other fields to find alternatives. Among them, the most important were wafer level packaging technology and plane contact research.

Through this program, researchers have developed many new technologies, one of which is planar interconnection technology, which will replace the wire rod with thin and flat metal wiring, and enable the surface emitting LED to be transferred to the surface of the package, which can effectively improve the luminous efficiency and reduce the use cost.

The research results can be applied to R & D products and production, and integrate LED in industrial applications to promote mobility in future applications. It can be applied not only to large scale TV walls, but also to surround lighting and sensing systems, and to promote the potential market of information entertainment.

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