Oulangte COB evaluation: ultra high COB is how to make?

At the beginning of the year, some of the big companies said their company's COB specificity:

1 three step macadam sorting.

The 2 color coordinate is lower than the blackbody radiation trajectory.

3 color rendering index greater than 90

Over the past six months, the three indicators who can do better?

High COB brought shock and Oulangte super! Shock! Shock! (important three times)

All the data is not supported by the introduction of bragging!

Well, the first data.

First, the test data

This is the specification:

The actual test came out like this:

The measured data, 2705lm@700mA; specifications suggest that 2940lm@750mA, supposedly in line with nominal values in specification. The actual test shows that the index is 96, R9 is greater than 95.

Two, color coordinates

This is the specification

The red dot in the figure, for the actual test data points into three completely step macadam ellipses, and color coordinates below blackbody radiation trajectory.

Actual test data are as follows:

At the same time, the data also reflect the changes of flux and color coordinate at different temperatures. Through the data can be found, the temperature from 25 degrees ~105 degrees luminous flux -14%, X:0.0003; Y:0.0085.

Curves of temperature and flux in the specification

Figure 25 to 100% luminous flux output, at a time of 105 degrees to maintain the rate of 84%, consistent with the measured data.

See these test data, the COB has reached a high level of technology. Take a look at this product has what particularity.

It is observed by X ray from 12 series of 7, a total of 84 chips. The chip is arranged in a cross shape, and is nearly circular in shape. From the overall point of view is very regular arrangement, gold wire welding is also very structured. At the two ends of the chip to the bracket, it can be found that there are different points on the spot of the gold wire solder joints. The quality of the gold wire bonding to the chip is very important, and by the influence of the surface treatment of the bracket, adding the conductive adhesive around the welding point can play a good role in the protection of the solder joint.

This product uses a mirror aluminum pressed substrate, a chip, the area is formed by the formation of plastic. From the exterior, the cofferdam rubber joints smooth. The fluorescent gel plane is lower than the plastic surface of the cofferdam, which is similar to that of CITIZEN.

This figure mainly to see Tc Point, temperature test point. Temperature test point of this product is on the aluminum substrate, the upper wiring layer to form a hollow bottom substrate plane bare, the plane also chip fixed plane, the actual temperature of the chip is the reaction. I talked to a lot of friends before. Where is the temperature test point to be appropriate? We have no conclusion. Personal opinion is that the closer to the actual temperature, the better the temperature.

At present, COB products are mainly used in commercial lighting products, the quality of color requirements are getting higher and higher. This product has a high level of display index and light effect, can meet the vast majority of commercial lighting.

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