SANYO semiconductor will export LED packaging with IMST backplane

SANYO semiconductor will be used for LED packaging purposes, began to export aluminum substrate for a single layer of the substrate, IMST aluminum substrate". The base plate is made of the aluminum substrate packaging technology IMST (insulated metal substrate technology) applied to the LED package substrate. Due to excellent heat dissipation, it helps to extend the life of LED, improve the performance of LED. When the high brightness LED is applied to the MST aluminum substrate, the temperature rise of LED can be reduced by about 60% compared with that of glass epoxy substrate. In addition, the increase of the allowable current of each LED, the temperature of the LED light is also very small, so it can ensure a stable illumination. Samples will be supplied from April 2008. SANYO semiconductor said that the monthly production capacity of more than 1000m2.

Source: Nikkei BP