SEMI:2008 semiconductor manufacturing equipment market size decreased by 27.7% over the previous year

Semiconductor equipment and Materials International Association (SEMI) held in the "SEMICON JAPAN 2008" on the occasion of the opening of the December 2, 2008 press conference to announce the 2008 forecast, the market size of the global semiconductor manufacturing equipment decreased 27.7% over the previous year, $30 billion 910 million.

SEMI, President and chief executive officer of Stanley T., said: "2008 is the lowest level since 2003. In 2009 there will be two digit negative growth. But if in 2010 followed the original industrial development model, the demand should be restored". SEMI predicts that in 2009 the market size of $24 billion 220 million compared to $21.4% in 2010, an increase of $30.8% compared to $09 in 31 billion 770 million.

According to the type of equipment in terms of sales in 2008, epitaxial wafer processing equipment is expected to decrease by 28.2% over the previous year, $22 billion 950 million. SEMI forecast, assembly and packaging equipment for the year to reduce the $23.8% to $2 billion 160 million, test equipment for the same period decreased by $3 billion 690 million to $27.1%.

Global sales trend of semiconductor manufacturing equipment (forecast value after 2008)

By region, the Taiwan market has declined significantly. Taiwan province has surpassed Japan in 2007 to become the world's largest market, but the market size is expected in 2008 in Taiwan will be reduced by 47.5% over the previous year, fell to $5 billion 590 million, the market share of the first throne again to japan. The Japanese market is 20.4% less than last year's $7 billion 420 million.