According to the international semiconductor equipment and Materials Association (SEMI) released the latest data show that in 2009, global semiconductor equipment sales reached $16 billion in 2010, the chip equipment market will reach $24 billion 500 million, an increase of about 53%, to 2011, the chip equipment market will further increase, reaching $31 billion 200 million, an increase of about 28%.
SEMI expects sales of wafer processing equipment is expected to decline to about $12 billion in 2009, a decline of about 46%. The market range will rebound 54% in 2010, and by 2011, its sales will grow further, reaching $23 billion 600 million, an increase of 28%.
According to SEMI sources, in 2009, the assembly and packaging equipment market is expected to reach $1 billion 400 million, a decline of 33%, but by 2011, the market will grow, will reach $2 billion 400 million. Meanwhile, in 2009, the semiconductor testing equipment market is expected to reach $1 billion 600 million, down about 55%, but by 2011, the market will also be an increase, will reach $3 billion 300 million.
SEMI pointed out that in 2009, the global market region has been a significant contraction. In 2010, the association said it was expected to be the main driver of growth in NAND spending by flash manufacturers, foundries and packaging subcontractors.
Sales of different types of equipment from SEMI:2008 to 2011
Sales of different market segments from SEMI:2008 to 2011
(http://www.digitimes.com/news/a20091203PR203.html)
Contact: mack
Phone: 13332979793
E-mail: mack@archled.net
Add: 3rd Floor, Building A, Mingjinhai Second Industrial Zone, Shiyan Street, Baoan, Shenzhen,Guangdong,China