SMIC Chengdu packaging plant in December 30th to start building

SMIC (SMIC) a total investment of 175 million U.S. dollars (about 1 billion 500 million yuan) of the Chengdu chip packaging and testing project to start construction in December 30, 2004. It is reported that after the completion of SMIC Chengdu plant will have integrated circuit packaging test 432 million annual production capacity, can be a global orders, the first phase of the project can provide at least 2500 jobs.

According to SMIC SMIC President Zhang Rujing said, Chengdu project is scheduled to be completed at the end of June 2005, the third quarter production. The first batch of SMIC Chengdu project is about to start working in Chengdu. Zhang Rujing said in Chengdu, the slowdown in the growth of the world's semiconductor industry at the same time, China's semiconductor industry will continue to grow rapidly, it is estimated that by 2010 the growth momentum will be very strong.

In addition, in response to China's demand growth, it is reported that SMIC will continue to expand the proportion of mainland customers. In the fourth quarter of 2004, mainland customer orders accounted for about 10% of total sales, the company hopes that part of the 2005 increase from 15% to 20%.