SONY chemical exhibits conductive adhesives for LED flip chip packaging

SONY chemical information device (Sony Chemical & Information Device) "in the third session of the new generation of lighting technology exhibition", for the anisotropic conductive adhesive LED flip chip package LEP1000 display". According to the company, if the LSI is usually used for anisotropic conductive adhesives used in LED chips, there will be heat and light due to the problem of discoloration, but LEP1000 improved heat resistance and light resistance. Compared with ultrasonic bonding, it is easier to package LED chip on the packaging substrate. Currently, the company is promoting products to LED manufacturers, is scheduled to start production in 2011.

In the company's booth, the brightness of the use of LEP1000 flip chip LED package of LED chip, and the wire bonding (Wire Bonding) brightness of LED encapsulation LED. According to the company, in the gold wire bonding conductor by flux method package LED chip is 100lm, easy to extract silver light conductor for 155lm, if LEP1000 is used, even if the use of gold plated conductor can be obtained 155lm luminous flux.