SUSS MicroTec and Fraunhofer IST jointly launched a new technology for selective surface treatment

Equipment and process leading global semiconductor industry and the related market solutions provider SUSS MicroTec, Fraunhofer IST and Fraunhof Association layer and Surface Technology Research Institute jointly announced the release called SELECT new technology for lithography and bond alignment, part by ion selective activation of the crystal sphere. Prior to the start of the wafer process plasma activation, can change the traditional process steps, effectively reducing the total cost per wafer. Selective plasma activation can be used in a variety of MEMS, optical and solar production processes, for the manufacture of micro mirror array, micro valve, sensor and micro channel direct wafer bonding or surface modification. SELECT is SUSS MicroTec MA/BA8 Gen3 optional upgrade components.

Fraunhofer IST SELECT technology is to apply for a patent. The technology can be used to selectively change the surface structure of the molecular level under the atmospheric pressure environment. The traditional surface treatment methods can not choose the region, only to deal with the entire wafer, which will affect or even damage the function of micro structures or electronic devices. Selective processing can protect sensitive areas and only activate specific parts of the wafer. The zone plasma treatment process can be used to process flat or three-dimensional wafers with a surface structure, which can be activated only in the cavity or only in a high structure.

"Using plasma processing technology in regional wafer bonding process, the bonding after the annealing temperature from 1000 DEG C to 200 DEG C, so as to effectively protect the fragile chip. This technique greatly expands the process window for wafer bonding. "Fraunhofer IST G nter Br for u? Uer says," SELECT SUSS MicroTec components, used for chip technology in the semiconductor industry, new technology for wafer bonding and other wafer process provides a breakthrough. "

"Wafer selection processing will effectively reduce chip line production costs, increase production capacity," SUSS MicroTec, President and chief executive officer Frank Averdung explained, "the new SELECT technology is likely to completely change the cost model for many applications. This creates an attractive opportunity for our new user of the manual lithography machine. "