Samsung developed 16GB flash chip equivalent to 20-30 nm human cells

November 2nd news, according to foreign reports, the Samsung Corp recently developed a new chip stack technology, it uses multi chip package form (MCP) 16GB NADN flash memory integrated on a single chip.

The new process will be 16 NAND flash memory chip integrated into the 16GB capacity of the tower. Samsung Corp said that the thinner MCP is the integration of many key technologies, such as thinner wafer, chip layer redistribution, chip appearance and wiring, etc..

Samsung Corp said the new wafer thinning technology can reduce the wafer thickness to 30 nm, equivalent to the size of 20-30 nm human cells.

An improved laser etching technique cuts the wafer into a single chip, but does not change it into fragments.

Samsung uses a layered technology to re stack the multi chip vertically, the new technology allows the chip package from a connection line, while the traditional method needs to be connected from both ends of the chip.

Due to the use of one end connection technology, each chip in the form of bending stack, so that the overall space and line length to a minimum, the thickness of the 16 chip package is 1.4mm.

Samsung Corp said in a statement, the new MCP technology to support the industry's demand for miniaturization and high-density storage devices, it can accommodate high intensity multimedia applications