Scheme of high power LED street lamp in road lighting (two)

Primary heat dissipation in LED package

LED packaging design of a heat dissipation by the production stage of the LED process to determine. Figure 2 shows the general flow diagram of LED packaging design, which is mainly composed of thermal design and thermal design of the package. As a result, through scientific and rational design can be satisfied with the thermal conductivity and heat dissipation effect of LED.

Figure 3 shows a typical LED packaging structure. Figure 3 shows that the lens material package is hardly heat conduction, its effect is the light output chip distribution and remove the heat of the chip is mainly composed of internal heat sink are then through an external heat sink, so a thermal design LED package is aimed at the requirements and conditions, scientific design through the internal heat sink heat generated by the chip effectively will export and transfer to the radiator.

Two heat dissipation scheme for LED

For the commercialization of high power LED, a thermal design is formed by the chip package is already fixed and cannot be changed when used as the light source used in lamps, need to design two solutions according to the actual working conditions and working conditions.

LED two heat dissipation design flow

LED two heat dissipation design flow is shown in figure 4. Mainly expressed as: Calculation of thermal resistance and junction temperature, see LED can meet the cooling requirements, if can meet the cooling requirements of direct output, if you can not meet the requirements of LED heat radiator design, and then look at the LED design can meet the cooling requirements, will need to optimize the design of the next step, not you need to re design of the radiator can meet the requirements, until now.