Semiconductor lighting show signs of bottoming out rebound

Although the international semiconductor equipment and Materials Industry Association (SEMI) announced in February the North American semiconductor equipment orders shipments ratio (Book-to-BillRatio) was only 0.48, but with the urgent and short single rapid return, semiconductor equipment market has seen Chun Yan. Foreign analysts predict that Intel, TSMC, South Asia branch, Toshiba, Samsung and other large manufacturers, has begun to purchase epitaxial wafer equipment, the United States also began to plan to purchase 45 and 40 nano devices.

According to the prediction of the world's largest semiconductor equipment factory application materials, equipment market last year by the impact of the financial tsunami, the scale of expenditure has been reduced to $23 billion 900 million, the reduction rate of about 31% years, may be reduced by 50% to 10 billion to $12 billion this year, a record 15 years minimum investment amount. SEMI recently released the February North American semiconductor equipment B/B value of 0.48, a new low since the order amount is SEMI since 1991 compilation of statistics B/B value.

In a pessimistic market on the occasion, with wafer foundries and IDM plant capacity utilization, picked up one after another in the urgent and short single line drive, semiconductor manufacturers have begun to discuss plans for procurement of equipment and equipment manufacturers, let the market boom of semiconductor equipment is encountered in the history of the worst recession, show signs of contact the reverse recovery.

According to Needham&Co.LLC analyst EdwinMok is expected in the latest research report, Intel, TSMC, South Asia branch, Toshiba, Samsung and other manufacturers, has seen the opportunity to purchase equipment. With wafer foundry TSMC as an example, the monthly plan will be 10 thousand pieces of 65 nanometer capacity, converted to 45 and 40 nm, that revenue accounted for less than 1% of the 45 and 40 nm in the fourth quarter revenue can be increased to 10% the proportion of. The TSMC is expected to require 45 nanometer devices will be shipped in late May, the purchase amount of about $3 to $400 million.

Because of the downturn of IDM plant, many IDM plant will reduce capital expenditure and accelerate outsourcing, it is expected that epitaxial wafer foundries will warm back capital spending in 2010, in addition to the TSMC second season will begin procurement of equipment, the report pointed out that in the UMC will start in the preparation and investment of 45 and 40 nanometer capacity, began to use capital expenditure action.

In the part of the memory market, although the DRAM factory is still facing pressure loss, but because the Taiwan government has made it clear that it will not provide funding directly to the DRAM plant, so in order to maintain the competitiveness of South Asia, to upgrade technology investment this year, the process of the groove type Jimengda (trench) conversion stack process (the micron technology transfer stack). Mok will be expected south through a $580 million (NT $20 billion) budget this year, but only a part of the expenditure.