Semiconductor manufacturing equipment industry to introduce cutting-edge technology to improve production efficiency

To keep up with the pace of development of technological progress, 2008 semiconductor manufacturing equipment, materials and spare parts industry will be a new round of product R & D. The introduction of the industry's most efficient production technology, to stir up the foundation of the development of electronic industry.

Challenges of micro nano technology

Recently published ITRS (international semiconductor technology roadmap) in-depth analysis of the next 15 years, the direction of the development of semiconductor technology.

A review of the development of the industry technology trajectory, we found that, in addition to the people gathered to look forward High-k gate dielectric is introduced, more than Moore (after Moore Technology) on the outside, also pay special attention to the electric system and computer memory (MEMS) dialogue between. November 2007 held in Hawaii, ITPC (Semiconductor Industry International Conference) also the diameter of 450 mm wafer, 3D oriented thin wafer of 45 m, the challenge of the following micro nano as the basic issues of the meeting.

In 2008 the industry is the subject of the next generation of technology on the basis of the establishment of efficient production lines, the introduction of new products.

Using thin chip technology to challenge the micro nano technology. In the field of advanced semiconductor manufacturing, it is necessary to calculate the shape of the packaging, the stress of the chip or the pressure in the production process. With the development of the wafer to the nanometer level, the Low-k layer used to eliminate the interference between the circuits will become more and more fragile. On the other hand, the parties began to introduce a higher degree of integration, lower energy consumption of thin stack 3D chip technology.

At present, the liquid penetration technology can already achieve fine exposure, but because the mask image graphics are out of shape, need to be adjusted, so the procedure of process equipment, material, film, abrasive manufacturers need to share information, the pace of reunification.

At present, the large foundry enterprises are integrating the previous process to the packaging process of the complete set of equipment.

Equipped with a chip printed circuit board also has the need for micro - and modular development. Manufacturers are required to abandon the traditional way of thinking alone, to join hands and work together to achieve integration in the packaging process and the motherboard process areas.

Surface polishing technology continues to develop

The next generation of 45 nanometer micro refinement node, the next generation of nano micro node technology is developing 32. Silicon wafer cutting, polishing, photoresist coating technology is still unable to overcome the surface of the wafer very fine foreign body. In order to overcome the increasing complexity and miniaturization of the exposure mask, the two exposure technique is used more and more. In order to make the exposure and development more subtle, the wavelength selection method is adopted more and more. The "immersion" technology based on the principle of refraction has become the mainstream of research and development.

In order to eliminate the adverse effects of the infiltration on the surface of the wafer, it is necessary to encode and remove the scratch on the surface of the wafer.

At present, the problem is that the circuit graph on the chip is easy to be washed out when washing, and the shape of the hole between the layers is different, and the surface is not smooth enough.

The materials used for surface polishing and processing are the best materials which are made up of hundreds of materials.

Semiconductor manufacturing equipment manufacturers in the world, the United States, Europe and the United States as the core of the research institutions to develop the best basic production technology. At the same time, it has undertaken the mission of revolutionary semiconductor products, such as technological innovation, productivity improvement, development of compound semiconductor laser light source and ultra high brightness LED production. In 2008, the industry will face severe challenges in the silicon cycle market, while further expansion of the market can also be predicted

Source: CCID - China Electronics News