Semiconductor packaging materials market in 2011 will reach $20 billion 200 million

International semiconductor equipment and Materials Industry Association (SEMI) display semiconductor packaging material together with TechSearch International global outlook published in 2007, including the thermal interface material, global semiconductor packaging materials market value will reach $15 billion 500 million in 2011 will further increase to $20 billion 200 million. Laminate substrate (Laminate Substrates) is still the largest proportion of the total in 2007 is expected to be $6 billion 200 million, in terms of the number of units, the next five years CAGR of more than 12%.

This market research report covers the laminated substrate, the flexible circuit board (Flex circuit/tape substrates), the lead frame (leadframes), bonding wire (mold compounds), molding compound, underfill materials, liquid packaging materials (liquid, encapsulants) (die attach materials bonding material), solder ball (solder balls), wafer level medium (wafer levEL package dielectrics package) and the thermal interface material (thermal interface materials).

In the part of equipment market, with the global economic growth slowed down, and many semiconductor manufacturers have been from the beginning of this year a large number of factors affecting the investment buy 12 inch wafer manufacturing equipment, is expected in the near future semiconductor manufacturers will slow down the pace of investment in equipment, this phenomenon has been reflected in the fourth order shipment status.

SEMI Book-to-Bill released in November shipment report pointed out that manufacturers three months average orders amounted to $1 billion 150 million, 2% less than the October final amount of $1 billion 180 million, and $1 billion 430 million in 2006 decreased by 19%, and returned to the same level of the same period in 2005. In the shipment performance, the average monthly shipments for the three months of November was $1 billion 390 million, down from $1 billion 430 million in October, compared with $1 billion 490 million in the same period last year. Total November North American semiconductor equipment market B/B Ratio (order to delivery ratio) was 0.82.

Source: International Electronic Business