TI two high-end mobile phone chipset is about to surface

TI (Texas Instruments Inc.) said it is testing two new semiconductor chip group, the new product is expected to help the third generation mobile communication (3G) mobile phone manufacturers to reduce costs and expand the market, which marks the 3G mobile phone market towards a new level.

TI executives announced plans on Tuesday in Tokyo, the mobile communication company and NTT (NTT DoCoMo Inc.) cooperation test a new top chip group, is expected this new assembly components of the mobile phone will be available in the Japanese market next year.

In addition, TI will also announced that it is testing a new processor, which aims to improve the performance of video products and high-end mobile phone support function.