TSMC will build two Fabs in Taiwan will start in April next year

Taipei day before the news, the giant chip foundry TSMC before the construction of it in Taiwan confirmed the Hsinchu science and Technology Park building two 300mm Fab and the two factory will start in April next year.

The park management agency officials said the day before Y.C.Ho, there will be five Fabs built in this area, including two TSMC, and PowerChip semiconductor company. TSMC recently announced the company's board of directors has approved the company's $1 billion 130 million in capital spending plans next year. The funds will be mainly used for the expansion of its 65nm and 90nm process technology on the 300mm wafer fab. But industry watchers are predicting that the company's capital spending next year will be higher than it has already approved, mainly considering the investment plans of the two new plants.

Institutional investors expect, Taiwan chip manufacturers including TSMC and head four DRAM chip manufacturer, next year will build 12 300mm fabs, the total capital expenditure of $350 billion dollars ($10 billion 600 million) this year, with an increase of 40%. These bold investment plans are motivated by expectations of optimism in the coming year. TSMC chairman Zhang Zhongmou in a number of fields collectively known as the global semiconductor industry next year will significantly improve, and Taiwan DRAM chip manufacturers are also holding this view.

TSMC will build two 300mm Fabs in Hsinchu science and technology park next year, while PowerChip semiconductor will build a total of two plants in the Hsinchu Science Park and Taichung science and technology circle. At the same time, Nanya Technology Corp and subsidiary InoteraMemories will cooperate to build four 300mm wafer fab, and ProMosTechnologies also began to build the same factory in two.