Technical innovation of semiconductor packaging manufacturers should be a line of five years"

For SMT and semiconductor packaging industry in the future, DEK company developed a macro development plan, that the wafer level accuracy and repeatability of 6-sigma and printed for the first time pass rate will become the basic function of the next generation of screen printing is required.

DEK CEO John Hartner said: "packaging manufacturers such as the lack of any of the above functions, they can not achieve commercial success. In addition to a very high resolution, high speed and low failure / repair rate to win and retain customers and make profits, packaging manufacturers no other way. These features are especially important in terms of gross margin and product and technology life cycles."

Hartner said the current technological development in about 5 years for a generation, and the goal of DEK is to provide advanced technology for the future development, ahead of the needs of users. He said: "the future of EMS technology partners required in the field must correctly identify look far ahead from a high plane, the day after the trend, and quick step with perfect solutions and technology. This is the key to retain existing customers and win new business to grow market share."

Hartner said: "we are actively developing with each generation of technology tools. We and our colleagues must provide this help, so that the package can quickly launch new products and advanced technology, including chip packaging, flip chip packaging and chip attachment and other wafer level process." At the same time, he pointed out that process solutions suppliers must use new technology to streamline equipment, optimize and manage advanced technology, as well as to reduce the operator's judgment on the production efficiency and the yield of the production line.

According to the introduction, a DEK approach to achieve these goals is to innovate the intuitive software reside between the user and the machine. DEK's Instinctiv and Interactiv software tools support remote monitoring and diagnostics, onboard error recovery and online assistance to enable sophisticated complex processes to be set, replaced, and removed faster. In practice, the user finds that this feature rich software layer allows them to implement the first printing process in the establishment of new qualified. According to reports, Instinctiv can set the simplified process into a series of menu options, without operator experience can build complex process, and senior technical staff experience and skills needed in the past can do. In this way, the package can be faster to launch new products and ensure the rapid realization of turnover, but also reduce the cost of unit production.

In addition to Internet based Interactiv software package, DEK new Instinctiv user interface with DEK's new control area network (CAN) technology based on the printing machine control infrastructure combined, can support remote diagnosis. The ISCAN (Intelligent scalable control local area network) infrastructure to support advanced precision communications, through the network of all machine subsystems, sensors and actuators, remote diagnosis. ISCAN also eliminates the need for traditional distribution racks, thus shortening assembly time and improving reliability.

DEK also pointed out that the future of the process requires solutions provider to the existing views on motion control and inspection challenge and overhaul solutions. Hartner another example, can directly affect the development of DEK products. He said: "we have created a new DEK Hawkeye system by streamlining the inspection process to the goal of pure quality, performing a high speed test to isolate defective components. On the one hand, Hawkeye can save a lot of production cycle time for the user, on the other hand, it can prevent the problem of the circuit board into the downstream process."

Hawkeye is highly quantitative inspection procedures provide faster "pass / fail" identification, reducing scanning time required for each board. In this way, the cycle time of each process can be highly controlled, and the circuit board can be effectively screened according to the predetermined production line beat. DEK also introduced a cutting-edge technology for motion control systems, including semiconductor packaging and chip attachment, to meet the requirements of wafer level packaging technology. The new position coding technique and the motor drive device can increase the execution speed to the maximum without excessive vibration in the body. At high resolution, the large vibration caused by the inertia and the motor rotation is easy to reduce the accuracy and repeatability, which makes a large number of defects in the advanced process.

Hartner concluded: "we must have the resources and technology to support customer demand for new generation technology future evolution. That is to say, those of us who need to look to the future at least 5 years, that is, the industry said the generation. Easy to say, this is what we all agree. But companies to maintain professional and soft skills, will show whether it is the leader of the material, in the market with ease or struggle for survival."