The change of the market 3G era of mobile phone components showed four trends

Mobile phone components can be divided into three parts, electronic display and most.

Electronic part refers to the electronic circuit board and the circuit board, the display part refers to the LED lamp display screen and keyboard light, structure comprises a casing and keys. Electronic components can be divided into active and passive components of the two categories, the so-called active refers to the characteristics of the components before and after the power will change, passive refers to the characteristics of the components before and after the power will not change. Active components include all semiconductor components, such as memory, baseband, RF, chord, application processor and camera, passive components including resistors, capacitors, inductors, connectors and circuit boards.

3G era, mobile phone components will not change in the nature. The industry definition of 3G is the downlink transmission rate above 384kbps, while the average 2G transmission rate is 128kbps. According to this standard, CDMA20001x, 1xEV-DO, 1x EV-DV and WCDMA phone is usually defined as the 3G mobile phone industry. The biggest difference between 3G and 2G is just the transmission rate has increased, but the increase of the transmission rate to greatly expand the mobile phone value-added service, 2G era because of the low transmission rate, many applications can not be carried out, such as mobile phone TV, mobile phone games, mobile phone banking, mobile phone video on demand. In the 3G era with the increase of the transmission rate can expand these applications. However, most of the components are not linked to the transmission speed, the biggest change is the mobile phone semiconductor components.

Baseband processor needs to improve performance

Mobile phone TV, mobile phone games, mobile phone banking, mobile phone video on demand applications need to handle a large amount of multimedia data, multimedia applications in the 2G era, the baseband processor to deal with the general, 3G era is not. There are two ways to solve this problem: one is to enhance the data processing ability of baseband processor; the other is to use the application processor ().

Multimedia and game will be a lot of MIPS, the strong performance of the multimedia applications can consume 200MIPS, game may also consume 200MIPS. Mobile baseband DSP allocated to multimedia applications is about 150-600MIPS between MIPS, while baseband DSP processing of WCDMA protocol requires approximately 150-200MIPS of communication signal performance.

WCDMA in accordance with the minimum 384kbps, we can calculate the performance of the baseband processor is about 100MIPS, and the minimum multimedia applications about 250MIPS, WCDMA frequency minimum performance should reach 350MIPS. The most commonly used DSP kernel TMS320C54X is clearly not competent. At present, the highest performance of the DSP kernel TMS320C55X is barely possible, in order to set aside a certain performance redundancy, it is best to match the application processor.

Did not develop a stronger DSP in TI or other companies before the high-speed WCDMA mobile phone application processor should use the DSP+ARM+ form. The application processor can be a separate chip or a multimedia accelerator engine.

Another change 3G is the most high-end mobile phone to the operating system, the operating system needs to support ARM kernel microprocessor. In other words, the future 3G mobile phone baseband may have 2 DSP and 2 ARM kernel. A DSP for communications, another DSP for application. A ARM for communication protocols and human-machine interface, another ARM for operating system.

TI launched WCDMA OMAPV2030 baseband processor only a multi user oriented at the end of 2005. ARM1136 is responsible for the operation of the operating system, ARM9 is responsible for the communication protocol stack 2, the operation of the 3 layer of software, TMS320C55X is responsible for the physical layer of the protocol stack, IVA2 responsible for multimedia acceleration.

Memory will be SDRAM in the world

Change led to the change of frequency of memory, the memory can be seen as auxiliary devices baseband processor operation. Three need to use embedded memory in the field of mobile phone, the first one is the data storage memory MCU and DSP when performing arithmetic, usually RAM; second is the storage of mobile phone software system code memory, usually NOR flash; third is the mobile phone extension data storage memory, flash memory is usually NAND. RAM is a volatile memory, NOR and NAND are nonvolatile memory devices.

Mobile phone with RAM memory is currently dominated by PSRAM, the capacity is about 32MB-64MB. PSRAM is divided into three schools, the first group is Hynix, Taiwan, NanoAmpSolutions, Winbond, Infineon and Renesas micron, Cypress, they push CellularRAM; second are Toshiba, Fujitsu and NEC, they are pushing COSMORAM; third are pushing Ut RAM samsung. However, the structure and characteristics of PSRAM, in the area of 108 square millimeters to maintain the PCB board, PSRAM capacity is difficult to exceed 256MB, more than 256MB of RAM needs must be met by SDRAM. So although it is divided into three schools, but the competition is not fierce, the future of 3G mobile phone RAM demand is certainly more than 256MB, there are already a lot of smart phones using the 512MB RAM. It can be predicted that the future is certainly the world of SDRAM, PSRAM sooner or later to retire.

Which broke the original mobile phone RAM memory industry pattern, previously provided by PSRAM and SDRAM mobile phone memory manufacturers are mainly Cypress, NEC, Toshiba, MITSUBISHI, these manufacturers or unable to produce SDRAM or SDRAM memory when the lack of competitiveness of production. And a number of the original production of SDRAM memory manufacturers such as Hynix, Elpida, Infineon and micron into the field, originally these manufacturers are PC manufacturers, SDRAM memory is used in the PC, these manufacturers have strong cost competitiveness in the production of SDRAM memory. With the further strengthening of mobile computing capabilities, SDRAM is not enough