The difference between LED packaging technology in China and foreign countries

I. overview

LED industrial chain overall is divided into upper, middle and lower reaches, respectively is LED, LED epitaxial chip encapsulation and LED application. As the link between LED and LED in the industrial chain, it plays an important role in the whole industry chain. Various applications of LED devices with large LED based devices, such as large LED screen liquid crystal display, LED backlight, LED lighting, LED lights and car lights, LED devices accounted for 40% to 70% of total cost in the application of the product, the performance and application of LED products to more than 70% by the performance of LED the decision device.

China LED package power, according to estimates of LED package number 80% of the world's focus on China, distribution in various American, Taiwan, Hong Kong, domestic packaging companies.

In the past five years, foreign companies continue to move, LED package, the development of growing domestic packaging companies, technology continues to mature and innovation. In the low-end LED device packaging field, the market share of China's LED packaging companies is higher, in the high-end LED device packaging field, some Chinese companies have a greater breakthrough. With the continuous maturity of technology and the accumulation of brand reputation, China LED packaging enterprises will play an important and leading role in China's LED application.

The following from all aspects of the LED packaging industry chain to explain these differences.

Two, packaging production and test equipment differences

LED packaging production equipment including solid crystal machine, welding machine, sealing machine, sorting machine, glue machine, smart oven etc.. Five years ago, LED automatic packaging equipment is basically the world of foreign brands, mainly from Europe and Taiwan, China has only a small amount of semi automatic solid crystal, welding equipment supply. In the past five years, LED China production equipment manufacturing industry has developed rapidly, and now the automatic solid crystal machine, sealing machine, automatic sorting machine, automatic dispensing machine, intelligent oven has the manufacturers supply, with a good price.

LED main test equipment including IS standard instrument, photoelectric integrated tester, TG tester, integral ball lumen tester, fluorescent powder tester and thermal shock, high temperature and high humidity reliability test equipment. In addition to the standard instrument mainly from Germany and the United States, other equipment currently has domestic manufacturers supply.

Currently Chinese LED package LED package in enterprises, enterprise scale has the forefront of the world's most advanced packaging equipment, this is the advantage of the decision. On the hardware level, China's LED packaging enterprises above the scale of the world's most advanced. Of course, some of the higher level of test analysis equipment has yet to be further equipped.

So China has the world's leading level in the hardware packaging equipment, equipped with advanced packaging technology and technology development.

Three, LED chip difference

At present, the Chinese LED chip company for about ten or so, started late, the scale is not big enough, chip companies LED the largest annual output value of about 3 hundred million yuan each, the average annual output value of 1 to 2 hundred million.

The development speed of LED chip companies this year, Chinese faster, enhance the level of technology is also very fast, small and medium size chip (15mil below) has been able to basically meet the domestic packaging needs of enterprises, large size chip (of power type W chip) has to be imported, mainly from the United States and Taiwan enterprises, but large size chip can only be entered in LED after the mass application of the general lighting.

The performance of LED package in 50% depends on the LED chip, LED chip core index including brightness, wavelength, loss of efficiency, antistatic ability, attenuation etc.. At present, the domestic small and medium size chip LED package most of the enterprise with domestic brands and foreign brands, smaller chip performance gap between these domestic brands, good price, also can meet the demand of the enterprise most LED applications. In particular, part of the performance of the chip brand has been quite comparable with foreign brands, through the packaging process technology, has been able to meet the needs of many high-end applications.

Four, packaging auxiliary material differences

Packaging auxiliary material comprises a bracket, gold, epoxy resin, silicone mold, etc.. The auxiliary material is an important basis for the performance of LED devices. The failure rate, attenuation rate, optical properties and energy consumption of LED devices can be decided by the quality of the auxiliary materials.

Present packaging auxiliary materials supply chain, China is perfect, most of the material has been able to produce supply in china. However, the high performance epoxy resin and silica gel are mostly imported. These two kinds of materials mainly require high temperature resistance, UV resistance, excellent refractive index and good expansion coefficient.

Along with the global integration process, China LED packaging enterprises have to be applied to the world's newest and best packaging auxiliary materials.

Five, packaging design differences

Package LED main frame type LED, surface mount LED and power LED three main class.

Packaging design LED including shape structure design, thermal design, optical design, materials, design and parameter design.

Design frame type LED has been relatively mature, mainly in the lifetime and optical matching, the failure rate can be further steps.

The design of SMD LED especially the top emission type TOP SMD in the continuous development, packaging design, packaging structure support size, material selection, optical design, thermal design and innovative technology, has a wide range of potential.

Design power LED is a new world. from