The global IDM will participate in the international conference held in Shenzhen packaging technology

By China Institute of Electronics Production Technology Association (CIE-CEPS) and IEEE-CPMT of the United States and other thirteen units jointly launched the Sixth International Conference on Electronic Packaging Technology (6th International Conference on by Electronics Packaging Technology, ICEPT2005 -9) in August 30th this year will be held in Shenzhen on 2 july. The workshop has been the world's packaging and testing assembly for 12 years, is one of the most influential activities in the global packaging and testing assembly.

So far, Congress has attracted including Samsung Semiconductor (Samsung), PHILPS semiconductor (Philips), TI (TI), Freescale Semiconductor (Carle Freescale), Intel (Intel), Infineon (Infineon), Fairchild Semiconductor (Fairchild), STMicroelectronics (ST), etc. the world's leading IDM manufacturers participants, the Organizing Committee has received the required number of 160 papers published.

Organizing committee revealed that these IDM makers in this seminar entitled "More than Moore" Opportunities and Challenges "," The development of electronics packaging technologies in SAMSUNG "," Introduction of JIS Related to Lead-free Solder and Soldering "," Electronic Packaging Needs for Solid-state Lighting "," Review of Advanced Electronics Packaging Technology "and a wonderful speech.