Toshiba intends to transfer the shares of the private equity business wafer reproduction figure

According to foreign media reports, Japan's Toshiba Co is planning its foundry business Toshiba ceramics company shares transfer to others, and currently has two Private Equity Firm expressed interest in buying.

According to the British Reuters quoted two unnamed sources reported that the Toshiba Co plans to sell Toshiba ceramic company 40.4% of the shares, and the receiver may be two private equity investment company consortium, respectively is Carlyle and Unision capital group company.

It is reported that the two private equity companies will register a new company, is responsible for the acquisition of Toshiba Co shares in Toshiba ceramics. According to Reuters, Toshiba Co has said in a statement that it is willing to transfer part of the shares in Toshiba ceramics company.

Media analysts pointed out that the ongoing transfer of private equity companies in line with the overall situation to enter the semiconductor industry trend. Not long ago, Holland PHILPS company transferred 80% shares of its PHILPS semiconductor company, is the recipient of the United States and Europe three private equity investment company, PHILPS semiconductor has been renamed NXP semiconductor company. Later, the United States Semiconductor giant Freescale Carle company has also been a number of private equity investment companies to buy. It is reported that, Cypress semiconductor company has recently become the target of private equity investment companies.

Toshiba ceramics is mainly responsible for the production of wafers, products available to Toshiba Co or other companies use the chip factory. In September, Toshiba announced that it would increase the production capacity of 300mm wafers. The company has previously announced plans in September 2007 to 40 thousand per month of the existing production capacity increased to 50 thousand per month, but mainly due to customer demand further, so the company decided in March 2008 will add 50 thousand pieces per month, 100 thousand per month.

Wafer is an important raw material for the production of chips, 300 mm diameter wafer size as a record. A wafer etching process, can get hundreds of pieces of small core. The core after the package test is listed in the sales chip (such as Celeron D, core 2).