A brief talk on flip eutectic LED Technology

Review: Recently, the media have been reported on the flip chip eutectic FlipChip and its extension of the package free ELC, CSP, POD technology, big leather "traditional packaging" of the trend of life.

In fact, flip chip technology in the semiconductor industry for a long time, in 2006 for the first time in the field of LED, followed by flip chip technology continues to develop, and penetrate into the chip level package, resulting in the concept of packaging. Since the light is removed from the sapphire substrate, it is not necessary to be removed from the current diffusion layer, and the current diffusion layer can be thickened and the current density is increased. The bottom of the grain is made of tin (Sn) or gold tin (Au-Sn) alloy, and the grain can be welded on the substrate with gold or silver plated. When the substrate is heated to a suitable eutectic temperature, gold or silver penetratesinto gold tin alloy layer, the eutectic layer and LED curing welding on the substrate, the heat from the chip to break the bottleneck of the cooling system of the substrate, enhance the life of LED.

A brief talk on flip eutectic LED Technology

Flip LED technology improves eutectic gold weld, high current capacity, thermal expansion and contraction caused by silica encapsulated gold and gold fracture process affecting yield and other issues. Excellent heat dissipation characteristics of high current drive can show its advantages in high power devices. With the increase of current, the efficiency of LED will decrease, and the effect of Droop will decrease. High power devices are mainly used in street lights, tunnel lights and high power fields, such as industrial and mining lamps, light effects have high requirements, such as 1-3W devices, the current can be 1000mA. In order to meet the actual needs of light, most of the use of 350mA. In addition, LED drive power supply based on conversion efficiency and cost considerations, tend to small current and high voltage, which is associated with flip chip represents a large current, low voltage drive back to the opposite direction.

At present, flip chip technology involves expensive production equipment and materials so that its cost is high, the price advantage can not be reflected. Flip the advent of LED technology market has been a long time, but due to many reasons, the delay can not be universal.