Discussion on the type of LED packaging structure

Introduction: Standard LED is considered by most customers as the most convenient and economical solution in the display industry.

LED packaging technology is mostly based on the development and evolution of discrete device packaging technology, but it has a lot of particularity. In general, the core of the discrete device is sealed in the package, the main role of the package is to protect the core and complete the electrical interconnection. The LED package is to complete the output signal to protect the normal operation of the core.

Package structure type:

Discussion on the type of LED packaging structure

Pin package

LED pin package using leadframe package for various shape pins, is the first R & D package structure success on the market, there are a large number of varieties, technology maturity is higher, the package structure and the reflecting layer is still in continuous improvement. The standard LED is considered to be the most customers to display solutions in the industry the most convenient and economical, the typical traditional LED placement in the envelope can withstand 0.1W input power, the 90% heat is radiated to the anode pin rack PCB plate, and then sent into the air, how to reduce the work of the PN junction the temperature rise is the packaging and application must be considered.

Surface mount package

Surface mount package LED (SMDLED) is accepted by the market, and access to a certain market share, from the pin to SMD package in line with the development trend of the entire electronics industry, many manufacturers have introduced such products. In the early days of SMDLED, most of them were made of SOT-23 with transparent plastic, and the tape was made up of coil and container. On the basis of SOT-23, the former is monochromatic light, the latter two or three color. In recent years, SMDLED has become a hotspot, a good solution to the brightness, perspective, smoothness, reliability and consistency, the lighter PCB plate and a reflecting layer material, epoxy resin less reflective layer in the display of the need to fill, and remove the heavier carbon steel pin, reduce weight by reducing the size, can easily reduce the weight of products in half, eventually make the application more perfect, especially suitable for indoor and semi outdoor full-color display applications.

Power package

LED chip and package to power direction, produce flux 10-20 times larger than the diameter of 5mmLED at high current, must use the packaging materials and effective heat dissipation without deterioration of the solution decay problem, therefore, shell and tube and packaging is one of the key technologies of LED packaging can withstand W power has emerged. 5W series of white, green, blue, green and blue LED power supply to start from the beginning of 2003, the white LED light output was 1871lm, 44.31lm/W green light attenuation, developed 10W can withstand the power of LED, a large area of pipe; dagger size is 2.5 * 2.5mm, can work in the 5A current, light output of 2001lm, as a solid state lighting source has great development space. The thermal characteristics of power LED directly affect the working temperature, luminous efficiency, luminous wavelength, and service life of LED. Therefore, it is very important to design and manufacture the power LED chip.

COB package

COB package can be directly packaged in a number of chips in the metal based printed circuit board MCPCB, through the substrate directly heat, not only can reduce the manufacturing process and the cost of the stent, but also has the advantages of reducing thermal resistance heat dissipation. From the cost and application point of view, COB become the mainstream direction of future lighting design. The LED module COB package installed multiple LED chip on the motherboard, the use of multi chip can not only improve the brightness, and helps to realize the rational allocation of the LED chip, the input current to reduce the amount of a single LED chip to ensure high efficiency. Moreover, the surface light source can enlarge the heat dissipation area of the package to a great extent, and make the heat transfer to the shell more easily.