As applied to the LED lamp JCDecaux announced global bulbs pellet forming a silica gel by OpsilSG-4702 test

An application on the LED lamp ball bubble lamp forming a silica gel OpsilSG-4702 days before through testing, the product through the "instant molding (instant forming)" technology to improve the process capability of LED filament manufacturing and manufacturing efficiency, the industrialized production of the new LED lamps become possible.

Professional manufacturer of microelectronic and optoelectronic applications of chemical materials (TECORE SYNCHEM) on the formation of JCDecaux announced before a product used in forming a silica gel OpsilSG-4702 pellet bubble lamp LED lamp has passed the test, this new type of optical silicone encapsulation type solid solution of LED filament. LED light bulb pellet is a kind of LED lighting model, use the LED package to replace the traditional incandescent tungsten filament, the. The two optical design for ordinary LED lighting, popular often need to be equipped with the lens and other optical devices, so that the illumination effect, not only reduce the energy efficiency of LED, also affect the comfort of eyes. LED light bulb pellet provides 360 degree angle of light, no halo, no dark zone and without lens, to achieve three-dimensional light source, comparable to the traditional lamp lighting experience. JCDecaux formation (TECORE SYNCHEM) forming a silica gel Opsil released the latest SG-4702, help LED filament wrapping solid type, with excellent forming ability and solid problem solving LED package flow properties of filament. The online test multiple vendors show that instant molding Opsil SG-4702 "(instant forming) technology can greatly improve the LED filament manufacturing process capability and manufacturing efficiency, and meet the demand of LED lamps with high reliability, high luminous flux, the industrial production of the new LED lamps become possible.

JCDecaux formation (TECORE SYNCHEM) is a professional manufacturer of chemical materials, is committed to providing innovative polymer packaging materials for microelectronic and optoelectronic industry solutions, the company's products are used in the field of LED silicone chip primer and high reliability optical epoxy resin etc..