Cortina and CISCO cooperation released a new chip level interconnect standard

Cortina systems and CISCO Systems announced the development of a new high-speed inter chip packet transfer protocol (Interlaken). This new protocol eliminates the cost and performance bottlenecks of existing interconnect standards using serial technology. CISCO Systems Inc. said interconnection between the chip has become an important factor restricting system device density and bandwidth of Interlaekn, using 6Gbps serial technology allows the designer can implement 20-40Gbps application interface, but also for the future to provide a possible 100Gpbs application. Interlaken is based on the popular SPI4.2 logic structure, retains the functionality of the SPI-4.2, while improving its bandwidth performance, reducing costs.