Development trends and characteristics of LED lighting packaging technology

Review: November 20th, sponsored by the OFweek Chinese high-tech industry portal, OFweek semiconductor lighting network, OFweek Lighting Network hosted the eleventh session of the OFweek LED advanced technology and market seminar "held in The Ritz-carlton Shenzhen. At the meeting, Shao Pengrui delivered a keynote speech entitled "LED lighting packaging technology trends and characteristics".

When talking about the development trend of LED lighting, Dr. Shao Pengrui said, in recent years, governments in advocating and related policies of energy conservation and emission reduction under the support of the traditional lighting market slowly indifferent down, with the declining of LED lighting technology promotion and price, demand for LED light will enter a rapid development stage. In the future for a long period of time, the traditional lighting products especially efficient lighting products will co-exist with the LED, when the LED demand and relative prices tend to a reasonable development trend, there will be a sharp increase in LED demand trend. From this, we can judge that the key factor for LED to enter the lighting market is the cost and reliability.

As engaged in packaging for many years, Dr. Shao Pengrui, at the meeting is more in-depth analysis of packaging technology trends, which means that the development of LED packaging technology has gone through four stages:

The first is a straight line, the general indicator;

Second is a small power patch series;

Third is the hottest COB series;

Fourth chip level packaging COB series.

On the function and structure of the LED packaging features, Dr. Shao Pengrui said, LED package with:

First, the role of mechanical protection, can enhance the ability to resist external forces.

Second, the role of environmental protection against static electricity, ultraviolet radiation, corrosive gases and other harmful factors;

Third, as the connecting carrier, lead out the power supply;

Fourth, has the control effect on light, light to achieve high efficiency, optimize the distribution of light source, light quality requirements to meet different applications;

Fifth, can be used as heat conduction channel, strengthen the heat conduction and heat dissipation to reduce the junction temperature, improve the performance of LED;

Sixth, power management, including AC DC conversion, as well as power control and other functions of the six.

At present, the structure of the chip can be divided into four types: vertical, horizontal, flip, high pressure and so on. Finally, from the four aspects of multi chip integration, miniaturization, intelligence and standardization, Shao Pengrui analyzed the development direction of LED packaging.