Henkel electronics new oriented application publishing electronic materials

Henkel electronics before the launch of new applications for Multicore LF328 free cleaning lead-free solder paste, Loctite and 3548/3549 bottom maintenance type CSP/BGA filler. Multicore LF328 is a non halogen, cleaning free lead-free solder paste, designed for fine pitch (0.5mm and 0.4mm CSP) and its design and application, low hole solder joint formula, can effectively improve the reliability and efficiency of production, wider and longer reflow window time can provide convenience for the implementation of outstanding performance. Lead free process, belongs to the class ROL0 (ANSI/J-STD-004).

Allegedly, LF328 has excellent adhesion, prevent high-speed SMT components occur when implementing small displacement; in high speed printing, printing pressure to minimize the deformation of the circuit board, and has excellent anti moisture performance. Because of these advantages, including the LF328 chemical nickel / gold, tin, silver and OSP chemical chemical surface treatment PCB has excellent welding activity, manufacturers can rely on using Multicore LF328 implementation of lead-free process.

Maintenance type at the bottom of the CSP/BGA filler Loctite 3548/3549, with the rapid flow of the unique formula, designed for CSP and BGA advanced package design, fast flow and low temperature curing, minimize the circuit board of the other components of the heat stress, and can be cured, the production efficiency of Ti Gaosheng online.

Fully cured Loctite 3548/3549 has excellent resistance to mechanical pressure, such as impact, drop, and vibration of the portable device. The test results show that the protection performance is more reliable than other products on the market. In addition, Loctite 3548/3549 and 0.5mm lead free components in the JEDEC drop test showed that the use of Loctite 3548/3549 than did not use the reliability of the bottom filler 4 times higher than that of the 0.4mm. Loctite 3548/3549 can be matched with a variety of modern lead-free solder materials, has a wider working window, can reduce the cost of expensive substrates and circuit boards, and can be repaired.

Henkel Chinese, Hongkong electronic business development manager Zhang Xiaomin said, Henkel Electronics Department, and constantly enrich and improve the existing product lines (including Loctite adhesive and phase-change materials, Multicore series welding materials, Hysol semiconductor and electronic packaging materials), to provide a full range of electronic materials for electronic industry customers to provide quality services for the majority of whenever and wherever possible. User.