Intel is planning 450 mm wafer next year with 45 nanometer process

According to foreign reports, Intel executives in the development of the conference said, Intel began planning to use 450 mm diameter wafer, chip production process and will use 45 nm from the beginning of next year.

At present, the semiconductor industry to use the largest size of the wafer is 12 inches in diameter (300 mm). Intel Gargini, a senior technical strategist, said Paolo, semiconductor manufacturers from the beginning of this year or next year plans to use 450 mm diameter wafer, the official production will begin in 2008. He said that Intel has now begun to plan to 450 mm diameter wafer migration.

The core area of more large wafer, not only can improve the performance of the chip, but also reduces the production cost, so the 300 mm diameter or larger wafers has become a trend of technological progress of the semiconductor industry. However, Gargini said that although the industry from 2001 to discuss the 12 inch (300 mm) diameter wafer, but today, only about 1/4 of manufacturers using a 12 inch wafer.

Allegedly, Intel has purchased 45 nanometer process equipment, and will make a formal upgrade plan in the year, is expected to be opened by the end of next year. On the 32 nanometer process, Intel will make a final decision in 2007.