LED production process by the end of the mass production

This year the domestic semiconductor equipment industry was the most remarkable is the hot spot of solar photovoltaic industry explosive development, is expected next year is still optimistic about the momentum of development. Due to the low barriers to entry, part of the domestic equipment, including injection diffusion furnace, cleaning machine, etc. in this industry has achieved no small achievements. With the start and development of national semiconductor lighting project, the huge market of LED chip equipment once again attracted the attention of domestic and international semiconductor equipment manufacturers. Domestic semiconductor equipment manufacturers want to find a place in the fierce market competition should be carried out from the following aspects: first, the technical aspects. Completely abandon the low-level simple mapping imitation mode, comprehensive and in-depth grasp of the key core technology. Second, application. Strengthen technical cooperation with customers, familiar with the process, improve equipment reliability. Third, talent. Through scientific human resources planning, the introduction of high-level management and technical personnel, for all types of personnel to do their best to provide a platform, which is the basis for the development of China's semiconductor industry. China Electric Power Technology Group forty-fifth in the development of the market, technological innovation has done the following work: first, the management, technology, process as the independent innovation of the three magic weapons. In the LED chip bonding equipment developed in the pre research stage, the 45 on the understanding of the mapping, imitation of the road, will always be able to run with, and can not be more than foreign large enterprises. Only process, is the starting point and focus of foreign equipment research and development. Therefore, the 45 completely abandoned the mapping of the intermediate links, directly targeting technology, around the process, in-depth communication with equipment manufacturers, process debugging to the production line, and according to the problems found combined with the product process are improved in different degree in all parts of the. After a year and a half of efforts, has successfully developed a suitable for the vertical LED process of DB-8002 adhesive film machine, and its indicators to achieve the level of similar foreign models. It is expected that by the end of 2006, the aircraft will be completed 60 units of mass production, provided to the domestic LED packaging manufacturers. Secondly, the segmentation of customer demand, to cut into the market. Silicon solar cell industry after the strong development of the past two years, has now become a scale. In a detailed analysis of customer needs, I Division decisive printing equipment on existing products to improve adaptability, developed WY-216 type screen printing, using two sets of visual system respectively in the perspective of range positioning point pattern printing graphics diagonal mark, and at the same time in the display; display using pointer generator. By adjusting the table printing graphics and printing template patterns on the diagonal positioning point mark with convenient operation, high alignment precision. For the characteristics of IC and the device manufacturer of multi variety and small batch, I developed a multi function suitable for the production of substrate or cavity module components of the welding machine, the device only needs to replace the bonding head, can achieve a variety of special pressure welding.