Ten LED packaging technology trends

Introduction: LED packaging industry as a moisture-proof cabinet (also known as moisture-proof box, drying box, drying cabinet) industry is an important support and follow-up development of important industries, for the major manufacturers of close attention. According to industry insiders predict that the future development of LED packaging technology is mainly to ten trends.

First, the power into the mainstream packaging.

At present, most of the products on the market are high power LED products or small power LED products, although they have their own advantages, but also have an insurmountable defect. Combined with the advantages of the two power LED products emerge as the times require, becoming the mainstream packaging.

Two, the application of new materials in packaging.

Due to the high temperature resistance, UV resistance and low water absorption, such as better and better environmental tolerance, thermosetting materials EMC, thermoplastic PCT, modified PPA and ceramic plastic materials will be widely used.

Three, chip current density applications.

The future chip current density will be determined by 350MA /mm? Development for 700MA/mm? Even higher. The chip demand voltage will be lower, more smooth VI curve (low calorific value), as well as ESD and VF.

Four, the popularity of COB applications.

With the advantages of low thermal resistance, light type, no welding and low cost, COM application will be widely used in the future.

Five, higher light quality needs.

Mainly for indoor lighting, indoor lighting products will use LED RA to 80 RA as the standard, to reach 90 as the goal, to make the lighting product light color close to the Planck curve, so the light can be uniform, no glare.

Six, international and domestic standards to further improve.

I believe that with the continuous improvement of LED packaging technology, domestic and international standards for the quality of LED products will continue to improve.

Seven, integrated packaging light engine into a package of values.

Integrated packaging light engine will become the next focus of research and development.

Eight, to power supply program (high voltage LED).

The future will be more concerned about the quality of indoor lighting, but at the cost of driving factors, to power supply will gradually become acceptable products, and to fully meet the high voltage LED power supply scheme, but it needs to be resolved is the need to strengthen the reliability of chip.

Nine, suitable for scene lighting multi-color LED light source.

Scene lighting will be the core competitiveness of LED lighting, and the next second LED lighting needs to rely on scene lighting to achieve.

Ten, the relative reduction in the efficiency of light efficiency, cost-effective to become the magic weapon packaging factory.

The future will not be too concerned about indoor lighting light effect, and will note the quality of light. With the improvement of packaging technology, the cost of LED lamp is reduced to be the driving force to replace the traditional lighting source.

The LED package from in-line LED, high power LED, PLCC to LED, and then to the ceramic package, EMC package, and the most popular package CSP, the technology evolution is always around the price (lm/$) and launched the theme.