The method to deal with the problem of LED heat dissipation

Here we take a look at the issue of LED heat sink solutions.

The method to deal with the problem of LED heat dissipation

Solution 1, aluminum heat sink

This is the most common form of heat dissipation, with aluminum fins as part of the shell to increase the heat dissipation area.

Solution 2, conductive plastic shell

The use of LED insulation cooling plastic instead of aluminum alloy radiator, can greatly improve the thermal radiation capacity.

Scenario 3, air hydrodynamics

The shell shape, create convection air, this is the lowest cost way to strengthen the heat.

Solution 4, liquid bubble

The transparent liquid filled with high thermal conductivity is filled into the bulb of the lamp body by the liquid bulb packaging technology. This is in addition to the principle of reflection, the only use of LED chips out of the smooth heat conduction, heat dissipation technology.

Scheme 5, the use of lamp holder

The utility model is characterized in that the utility model has the advantages that the utility model has the advantages that the utility model is mainly used for the internal space of the lamp holder in the small power LED lamp of the household type. This can be used as a screw cap so large metal surface heat lamp, lamp holder is tight because the metal electrode and the power line. So part of the heat can be derived from the heat dissipation.

Scheme 6, insulation heat exchange plastic instead of aluminum alloy

The heat insulation plastic replaces the aluminum alloy to make the heat dissipation body, this kind of LED insulation heat dissipation plastic, maintains the heat dissipation ability and the aluminum alloy is at the same time, causes the heat radiation ability to enhance 4-8 times. With this heat sink material made of LED heat dissipation significantly enhance the overall cooling effect.

Solution 7, heat conduction and heat integration - the use of high thermal conductivity of ceramics

The lamp cooling is designed to reduce the operating temperature of the LED chip, the LED chip expansion coefficient and we used the metal heat conduction, heat dissipation material expansion coefficient difference, can not be welded directly to the LED chip, so as to avoid the high and low temperature thermal stress damage of LED chip. The latest high thermal conductivity ceramic material, thermal conductivity is close to aluminum, the expansion line can be adjusted to synchronize with the LED chip. In this way, heat conduction and heat dissipation can be integrated to reduce the heat conduction intermediate link