This summer is not hot LED heat out of the new technology

LED chip LED lamp in the electronic components of heat flux greatly, they are in the process of operation, due to the loss of static and dynamic, produce large amounts of excess heat, the cooling system divergence to the outside, to maintain its temperature stability. At present, the luminous efficiency of LED is relatively low, which leads to the increase of junction temperature and the decrease of life. In order to reduce the junction temperature in order to improve the life must pay great attention to the problem of heat dissipation. LED thermal design must start from the beginning of the chip to the entire radiator, each link should be given full attention. Improper design of any one link will cause serious heat problems. Therefore, the design of the heat must be given full attention.

High performance micro groove group composite phase change heat transfer technology can meet the heat dissipation requirements of high-power LED lighting". The technology has been successfully applied on the LED lamp, the heat energy of the LED chip can be distributed in the whole space, and the lifetime of the LED lamp is prolonged.

Integrated cooling technology of micro groove group:

The heat generated by the LED chip is always scattered through the shell of the lamp into the air. The general heat dissipation is: the heat generated by the LED chip, from its metal heat sink out, first through the solder to the aluminum substrate PCB, and then through the thermal conductivity of aluminum radiator. LED lamp heat dissipation actually includes two parts of heat conduction and heat dissipation. There is a concept to be clear, that is, the difference between heat conduction and heat dissipation. Heat conduction is the fastest heat transfer from the heat source to the radiator surface, and the heat is to heat the surface from the radiator to the air. First of all, the heat should be the fastest out, and then the most effective way to disperse into the air. The traditional heat sink of heat sink is aluminum fin, our heat sink is: micro groove group phase change technology.

Microgrooves phase-change cooling technology is to rely on technical means (such as equipment structure: micro channel and other means) to a closed loop cooling medium (if the medium is water) into the water film nanometer scale, the water film is thin, heat evaporation latent heat exchange ability stronger, stronger ability, high power electronic devices steam heat is taken away.

Cooling system composition and working principle:

1, the composition of the cooler:

The system is mainly composed of four parts, namely, heat exchanger, condenser, pipeline, heat medium (such as water, ethanol, etc.).

Made of imported Aluminum Alloy heat exchanger in general, plate groove cavity with many micron order, and its role is to take the hot medium (such as water) according to the design requirements into the required film, in close contact with the surface of the heating power devices and Aluminum Alloy, its heat through heat conduction to the aluminum film, instant film the heat of vaporization, sent to the condenser through the pipeline. Because of the heat capacity from heat exchanger is very strong, its thermal conductivity is greater than 106 W/ (m* C), so the heat exchanger volume can be very small.

Made of imported Aluminum Alloy condenser in general, plate groove cavity with many mm magnitude, Aluminum Alloy rib plate, heat medium through the pipeline sent heat from which is responsible for the convective and radiative heat transfer and outdoor air, heat heat release medium through the condenser, vapor variable liquid liquid medium, heat from its own gravity back to the heat exchanger, ready for the next heat exchange cycle.

2, working principle:

In the microgrooves phase change composite surface heat exchanger from many micro channel, the formation of microgrooves structure, the use of micro scale composite phase change heat transfer enhancement mechanism, implementation in small space, small volume of the device on the high current density and high power efficiency to heat. Microgrooves phase change composite heat exchanger heat removed by steam through the steam loop transport to high efficient micro structure remote condenser, condenser in micro structure in micro scale condensation tank group structure on the surface of high strength micro scale steam condensation heat transfer. The condensation heat release can be quickly spread to the micro scale condensation structure surface grooves, and the wall facing outside the guide to the rib surface micro structure on the outer wall of the condenser, the heat is released into the environment through convection heat transfer and the external environment. The condensed liquid flows back to the micro groove group composite phase change heat exchanger through the condensation liquid circuit. In order to achieve high efficiency and no power consumption of the system, it can achieve the purpose of cooling. The hot surface of the micro groove group composite phase change heat exchanger is closely contacted with the power electronic device, and the inner surface of the utility model is provided with a plurality of composite phase change micro channels, which are integrated into a composite phase change micro groove group. There are a small amount of liquid medium with a certain latent heat of vaporization in the micro groove group composite phase change heat exchanger. The liquid refrigerant is formed in the microgrooves structure under the action of capillary pressure gradient along the micro channel flow, and expansion of high strength fine scale composite phase-change meniscus thick liquid film evaporation and nucleate boiling heat transfer enhancement in the formation process of micro channel, so that the liquid refrigerant into steam, great heat the use of power electronic devices take the latent heat of vaporization at work, which will reduce the working temperature and control devices in the ideal range. The micro groove group compound phase change cooling system is composed of a small size heat collection element (a micro groove group composite phase change heat collector), a heat and fluid transport pipeline, and a remote heat release component (a remote micro structure condenser). Among them, the heat and fluid transport pipeline includes two parts, the steam circuit and the condensate circuit